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Hoelck, Ole
8  Ergebnisse:
Personensuche X
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1

Low‐Temperature Processible Highly Conducting Pastes for Pr..:

Scenev, Vitalij ; Szalapak, Jerzy ; Werft, Lukas...
Advanced Engineering Materials.  24 (2022)  9 - p. , 2022
Link: https://doi.org/10.1002/..
 
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2

Fan-Out Wafer and Panel Level Packaging as Packaging Platfo..:

Braun, Tanja ; Becker, Karl-Friedrich ; Hoelck, Ole...
Micromachines.  10 (2019)  5 - p. 342 , 2019
Link: https://doi.org/10.3390/..
 
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3

Low‐Temperature Processible Highly Conducting Pastes for Pr..:

Scenev, Vitalij ; Szalapak, Jerzy ; Werft, Lukas...
1527-2648.  , 2022
Link: https://depositonce.tu-b..
 
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4

Low-Temperature Processible Highly Conducting Pastes for Pr..:

Scenev, V ; Szalapak, J ; Werft, Lukas...
Advanced engineering materials.  , 2022
Link: https://publica.fraunhof..
 
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5

Fan-Out Wafer and Panel Level Packaging as Packaging Platfo..:

Braun, Tanja ; Becker, Karl-Friedrich ; Hoelck, Ole...
2072-666X.  , 2019
Link: https://depositonce.tu-b..
 
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6

Fan-Out Wafer and Panel Level Packaging as Packaging Platfo..:

Braun, Tanja ; Becker, Karl-Friedrich ; Hoelck, Ole...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC6562530/.  , 2019
Link: http://www.ncbi.nlm.nih...
 
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7

Fan-Out Wafer and Panel Level Packaging as Packaging Platfo..:

Tanja Braun ; Karl-Friedrich Becker ; Ole Hoelck...
https://www.mdpi.com/2072-666X/10/5/342.  , 2019
Link: https://doi.org/10.3390/..
 
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8

Fan-Out Wafer and Panel Level Packaging as Packaging Platfo..:

Tanja Braun ; Karl-Friedrich Becker ; Ole Hoelck...
A:Physics.  , 2019
Link: https://doi.org/10.3390/..
 
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