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Hong, Mi-Song
13712  Ergebnisse:
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1

Effects of salinity on life history traits and fatty acid-b..:

Hong, Mi-Song ; Yoon, Deok-Seo ; Kim, Ji-Su...
Aquaculture.  578 (2024)  - p. 740114 , 2024
Link: https://doi.org/10.1016/..
 
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2

Effects of bisphenol A on reproduction, oxidative stress, a..:

Yoon, Deok-Seo ; Kim, Ji-Su ; Hong, Mi-Song...
Marine Pollution Bulletin.  205 (2024)  - p. 116553 , 2024
Link: https://doi.org/10.1016/..
 
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3

Thermal Cycling Performance of Heterogeneous Solder Ball Jo..:

Bae, Joo Young ; Kim, Mi-Song ; Hyun, So-Hee...
Journal of Welding and Joining.  42 (2024)  2 - p. 174-183 , 2024
Link: https://doi.org/10.5781/..
 
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4

Bonding Characteristics of Solder and Sinter Joints on Acti..:

Kim, Mi-Song ; Hong, Won Sik ; Kim, Yong-Mo
Journal of Welding and Joining.  41 (2023)  6 - p. 558-565 , 2023
Link: https://doi.org/10.5781/..
 
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5

Electrochemical Metallic Ion Migration Property of Multi-La..:

Hong, Won Sik ; Kim, Mi-Song ; Bae, Joo Young...
Journal of Welding and Joining.  41 (2023)  6 - p. 519-527 , 2023
Link: https://doi.org/10.5781/..
 
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6

Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball..:

Bae, Joo Young ; Kim, Mi-Song ; Lee, Hye Min...
Journal of Welding and Joining.  41 (2023)  5 - p. 379-386 , 2023
Link: https://doi.org/10.5781/..
 
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7

Bonding Property of Flip-Chip Chip-Scale Package with Vacuu..:

Hyun, So-Hee ; Lee, Hye Min ; Kim, Mi-Song.
Journal of Welding and Joining.  41 (2023)  5 - p. 387-395 , 2023
Link: https://doi.org/10.5781/..
 
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8

Solder Joint Degradation and Electrochemical Metallic Ion M..:

Lee, Hye Min ; Kim, Mi-Song ; Hong, Won Sik
Journal of Welding and Joining.  41 (2023)  4 - p. 265-274 , 2023
Link: https://doi.org/10.5781/..
 
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9

Laser Soldering Process Optimization of MEMS Probe of Probe..:

Kim, Myeongin ; Hong, Won Sik ; Kim, Mi-Song
Journal of Welding and Joining.  40 (2022)  3 - p. 271-277 , 2022
Link: https://doi.org/10.5781/..
 
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10

Optimization of FC-CSP and MLCC Soldering ProcessUsing Type..:

Lee, Hye-Min ; Kim, Mi-Song ; Kim, Myeongin.
Journal of Welding and Joining.  40 (2022)  2 - p. 165-174 , 2022
Link: https://doi.org/10.5781/..
 
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11

Effects of Solder Powder Particle Size and Substrate Surfac..:

Kim, Mi-Song ; Hong, Won Sik ; Lee, Hye-Min.
Journal of Welding and Joining.  40 (2022)  3 - p. 207-214 , 2022
Link: https://doi.org/10.5781/..
 
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12

Upper-Limb Robot-Assisted Therapy Based on Visual Error Aug..:

Cho, Ki-Hun ; Hong, Mi-Ran ; Song, Won-Kyung
Healthcare.  10 (2022)  7 - p. 1186 , 2022
Link: https://doi.org/10.3390/..
 
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13

Ultrasonic Bonding Interface Degradation Characteristics of..:

Kim, Mi-Song ; Hong, Won Sik ; Kim, Sang Yeop..
Journal of Welding and Joining.  39 (2021)  4 - p. 343-348 , 2021
Link: https://doi.org/10.5781/..
 
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14

MLCC Solder Joint Property with Vacuum and Hot Air Reflow S..:

Hong, Won Sik ; KIm, Mi-Song ; Kim, Myeongin
Journal of Welding and Joining.  39 (2021)  4 - p. 349-358 , 2021
Link: https://doi.org/10.5781/..
 
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15

Microstructural Evolution of Cantilever Wire Probe after To..:

Hong, Won Sik ; Kim, Mi-Song ; Kim, Myeongin
Journal of Welding and Joining.  39 (2021)  6 - p. 677-683 , 2021
Link: https://doi.org/10.5781/..
 
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