E-LIB Suche - Ergebnisse für: Howlader, M M R

1

A double negative (DNG) metamaterial based on parallel doub..:

Hussain, Altaf ; Dong, Jian ; I.Abdulkarim, Yadgar...
Results in Physics. 46 (2023) - p. 106302 , 2023

Link: https://doi.org/10.1016/..

2

Analyzing chronic disease biomarkers using electrochemical ..:

Sinha, K. ; Uddin, Z. ; Kawsar, H.I....
TrAC Trends in Analytical Chemistry. 158 (2023) - p. 116861 , 2023

Link: https://doi.org/10.1016/..

3

Thermoelectric generation via tellurene for wearable applic..:

Liu, E. ; Negm, A. ; Howlader, M.M.R.
Materials Today Energy. 20 (2021) - p. 100625 , 2021

Link: https://doi.org/10.1016/..

4

Fast and environmentally friendly fabrication of superhydro..:

Niu, C.N. ; Han, J.Y. ; Hu, S.P....
Surfaces and Interfaces. 22 (2021) - p. 100830 , 2021

Link: https://doi.org/10.1016/..

5

The effects of oxygen plasma and humidity on surface roughn..:

Alam, A U ; Howlader, M M R ; Deen, M J
Journal of Micromechanics and Microengineering. 24 (2014) 3 - p. 035010 , 2014

Link: https://doi.org/10.1088/..

6

Charge transfer and stability of implantable electrodes on ..:

Howlader, M.M.R. ; Doyle, T.E. ; Mohtashami, S..
Sensors and Actuators B: Chemical. 178 (2013) - p. 132-139 , 2013

Link: https://doi.org/10.1016/..

7

Oxygen Plasma and Humidity Dependent Surface Analysis of Si..:

Alam, A. U. ; Howlader, M. M. R. ; Deen, M. J.
ECS Journal of Solid State Science and Technology. 2 (2013) 12 - p. P515-P523 , 2013

Link: https://doi.org/10.1149/..

8

Surface activation-based nanobonding and interconnection at..:

Howlader, M M R ; Yamauchi, A ; Suga, T
Journal of Micromechanics and Microengineering. 21 (2011) 2 - p. 025009 , 2011

Link: https://doi.org/10.1088/..

9

Hybrid plasma bonding for void-free strong bonded interface..:

Howlader, M.M.R. ; Kibria, M.G. ; Zhang, F..
Talanta. 82 (2010) 2 - p. 508-515 , 2010

Link: https://doi.org/10.1016/..

10

Influence of nitrogen microwave radicals on sequential plas..:

Howlader, M.M.R. ; Wang, J.G. ; Kim, M.J.
Materials Letters. 64 (2010) 3 - p. 445-448 , 2010

Link: https://doi.org/10.1016/..

11

Void nucleation at a sequentially plasma-activated silicon/..:

Howlader, M M R ; Zhang, F ; Kibria, M G
Journal of Micromechanics and Microengineering. 20 (2010) 6 - p. 065012 , 2010

Link: https://doi.org/10.1088/..

12

Interfacial Behavior of Surface Activated p-GaP/n-GaAs Bond..:

Howlader, M. M. R. ; Suga, T. ; Zhang, F...
Electrochemical and Solid-State Letters. 13 (2010) 3 - p. H61 , 2010

Link: https://doi.org/10.1149/..

13

Investigation of bonding strength and sealing behavior of a..:

Howlader, M.M.R. ; Kaga, T. ; Suga, T.
Vacuum. 84 (2010) 11 - p. 1334-1340 , 2010

Link: https://doi.org/10.1016/..

14

Void-free strong bonding of surface activated silicon wafer..:

Howlader, M.M.R. ; Zhang, F.
Thin Solid Films. 519 (2010) 2 - p. 804-808 , 2010

Link: https://doi.org/10.1016/..

15

Hybrid plasma bonding of germanium and glass wafers at low ..:

Howlader, M.M.R. ; Kibria, M.G. ; Zhang, F.
Materials Letters. 64 (2010) 13 - p. 1532-1535 , 2010

Link: https://doi.org/10.1016/..