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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
5
High Q-Factor 3D Tall Copper Pillar Inductor on a Wafer-Lev..:
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2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC) ,
11
HybridGP: Global Placement for Hybrid-Row-Height Designs:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
12