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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
3
Stress Analysis Optimization And Prediction Of Stack BGA So..:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
6
Analysis and optimization of torsional stress in the solder..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
8
Analysis of residual stress after reflow soldering of QFN p..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
9