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Huang, Mingliang
1145  Ergebnisse:
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1

Magmatic-hydrothermal redox state and ore-controlling facto..:

Deng, Ju-Ting ; Zhu, Jing-Jing ; Hu, Ruizhong...
Ore Geology Reviews.  168 (2024)  - p. 106040 , 2024
Link: https://doi.org/10.1016/..
 
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2

Apatite as a Record of Magmatic–Hydrothermal Evolution and ..:

Zhang, Yao-Wen ; Zhu, Jing-Jing ; Pan, Li-Chuan...
Minerals.  14 (2024)  4 - p. 373 , 2024
Link: https://doi.org/10.3390/..
 
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3

Mantle contribution to the generation of the giant Jinduich..:

Xu, Lei-Luo ; Bi, Xian-Wu ; Zhang, Xing-Chun..
Chemical Geology.  616 (2023)  - p. 121238 , 2023
Link: https://doi.org/10.1016/..
 
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4

Melting of Subducted Continental Crust in the Cimmerian Col..:

Yang, Zong-Yong ; Bi, Xian-Wu ; Zhu, Jing-Jing...
Lithosphere.  2023 (2023)  1 - p. , 2023
Link: https://doi.org/10.2113/..
 
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5

Collapse behavior and interfacial reaction of Cu-cored sold..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Yuan, Mingqi ; Zhu, Lin ; Huang, Mingliang - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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6

Design of Array Antenna for High-Strength Radiation Field G..:

, In: 2023 Cross Strait Radio Science and Wireless Technology Conference (CSRSWTC),
Dong, Jing ; Huang, Mingliang ; Li, Yongzhi - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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7

Electromigration-induced failure behavior of low-temperatur..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Li ; Wang, Shengbo ; Chen, Junlin. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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8

Full Ni3Sn4 IMC interconnects prepared by current driven bo..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Chen, Zhikai ; Liu, Peng ; Ren, Jing. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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9

Microstructural evolution and thermal fatigue reliability o..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Shanhong ; Ren, Jing ; Huang, Mingliang - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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10

Wafer bumping of Sn-Ag micro-bumps with high coplanarity:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Na ; Huang, Feifei ; Yan, Yan... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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11

Finite element analysis of board-level drop reliability of ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Zhiyi ; Zhu, Lin ; Huang, Mingliang - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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12

Genesis of the Eocene oxidized potassic felsic volcanic roc..:

Liu, Gong ; Xu, Lei-Luo ; Bi, Xian-Wu...
Lithos.  436-437 (2023)  - p. 106983 , 2023
Link: https://doi.org/10.1016/..
 
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13

Effects of electroplating parameters on composition and mor..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Huang, Feifei ; Huang, Mingliang - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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14

Microstructure and mechanical properties of Sn-Ag-Cu/Sn-Pb ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Gu, Shengxiang ; Yin, Siqi ; Huang, Mingliang - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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15

A highly stable electroplating bath for micro-scale Sn-Ag s..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Hu, Fengming ; Huang, Feifei ; Yan, Yan... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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