Huang, Yong-Ta
2672  Ergebnisse:
Personensuche X
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2

Development of genetically engineered CD4+ and CD8+ T cells..:

Luo, Wei ; Zhang, Xiao-Bing ; Huang, Yong-Ta...
Journal of Molecular Medicine.  89 (2011)  9 - p. 903-913 , 2011
 
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3

Dynamic monitoring the TCR CDR3 spectratypes in patients wi..:

Luo, Wei ; Liao, Wang-Jun ; Ma, Li...
Cancer Immunology, Immunotherapy.  59 (2009)  2 - p. 247-256 , 2009
 
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4

Attenuation of glazing energy using linear patterns on the ..:

Lin, Shiang-Jiun ; Chen, Yong-Cheng ; Li, Hao-Hu.
Advances in Mechanical Engineering.  7 (2015)  12 - p. 168781401561937 , 2015
 
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5

Decreased GRP78 Protein Expression is a Potential Prognosti..:

Huang, Tze-Ta ; Chen, Jeff Yi-Fu ; Tseng, Chih-En...
Journal of the Formosan Medical Association.  109 (2010)  5 - p. 326-337 , 2010
 
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6

Dual watermarking algorithm based on the Fractional Fourier..:

Tang, Lin-Lin ; Huang, Chun Ta ; Pan, Jeng-Shyang.
Multimedia Tools and Applications.  74 (2013)  12 - p. 4397-4413 , 2013
 
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8

Temperature-insensitive Mach-Zehnder interferometer filters..:

, In: 2024 IEEE Silicon Photonics Conference (SiPhotonics),
 
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11

MultiMedia Modeling: 26th International Conference, MMM 202.. 

Information Systems and Applications, incl. Internet/Web, and HCI, 11962
Ro, Yong Man ; Cheng, Wen-Huang ; Kim, Junmo... - 1st ed. 2020 . , 2020
 
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12

MultiMedia Modeling: 26th International Conference, MMM 202.. 

Information Systems and Applications, incl. Internet/Web, and HCI, 11961
Ro, Yong Man ; Cheng, Wen-Huang ; Kim, Junmo... - 1st ed. 2020 . , 2020
 
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13

Correction to: MultiMedia Modeling:

, In: MultiMedia Modeling; Lecture Notes in Computer Science,
Ro, Yong Man ; Cheng, Wen-Huang ; Kim, Junmo... - p. C1-C1 , 2019
 
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14

Correction to: MultiMedia Modeling:

, In: MultiMedia Modeling; Lecture Notes in Computer Science,
Ro, Yong Man ; Cheng, Wen-Huang ; Kim, Junmo... - p. C1-C1 , 2019
 
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15

Light enhanced direct Cu bonding for advanced electronic as..:

Liang, Sin-Yong ; Song, Jenn-Ming ; Huang, Shang-Kun...
Journal of Materials Science: Materials in Electronics.  29 (2018)  16 - p. 14144-14150 , 2018
 
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