Hubing, Todd
12  Ergebnisse:
Personensuche X
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1

Signal Integrity and Power Integrity:

Tripathi, Jai Narayan ; Niu, Li ; Hubing, Todd
IEEE Electromagnetic Compatibility Magazine.  12 (2023)  3 - p. 35-43 , 2023
 
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2

Announcing Special Sessions in Spokane!:

Hubing, Todd ; Maradei, Francesca
IEEE Electromagnetic Compatibility Magazine.  11 (2022)  1 - p. 94-94 , 2022
 
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3

Announcing Special Sessions in Spokane!:

Hubing, Todd ; Maradei, Francesca
IEEE Electromagnetic Compatibility Magazine.  10 (2021)  4 - p. 67-67 , 2021
 
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4

Examination of contaminant-induced faults in connectors:

Zeng, Hua ; Hubing, Todd
IEEE Electromagnetic Compatibility Magazine.  1 (2012)  4 - p. 47-52 , 2012
 
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5

Power bus decoupling on multilayer printed circuit boards:

Hubing, Todd H. ; Drewniak, James L. ; Van Doren, Thomas P..
IEEE Electromagnetic Compatibility Magazine.  9 (2020)  2 - p. 66-77 , 2020
 
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6

Common PCB layout errors that cause products to fail to mee..:

Hubing, Todd H.
IEEE Electromagnetic Compatibility Magazine.  8 (2019)  3 - p. 86-91 , 2019
 
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7

Study of the impact of board orientation on radiated emissi..:

, In: 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC),
 
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11

Electromagnetic Compatibility Issues in Automotive Communic..:

, In: Automotive Informatics and Communicative Systems,
Hubing, Todd H. - p. 48-68 , 2009
 
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