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Hung, Chia-Lung
8638  Ergebnisse:
Personensuche X
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1

Investigation of Positive Bias Temperature Instability of 4..:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
Wen, Yu-Xin ; Wang, Chia-Hua ; Hsiao, Yi-Kai.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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2

Characterization of 4H-SiC PMOSFET with P+ Poly-Si Gate:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Hung, Chia-Lung ; Tsui, Bing-Yue - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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3

Investigation of the time dependent gate dielectric stabili..:

Lin, Wei-Cheng ; Yu, Wei-Chen ; Chen, Bang-Ren...
Microelectronics Reliability.  150 (2023)  - p. 115141 , 2023
Link: https://doi.org/10.1016/..
 
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4

Design, Process, and Characterization of Complementary Meta..:

Hung, Chia-Lung ; Tsui, Bing-Yue ; Tsai, Te-Kai..
ECS Journal of Solid State Science and Technology.  11 (2022)  4 - p. 045001 , 2022
Link: https://doi.org/10.1149/..
 
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5

Modeling and Characterization of the Narrow-Width Effect of..:

Hung, Chia-Lung ; Tsui, Bing-Yue ; Shih, Chun-Pin.
IEEE Transactions on Electron Devices.  69 (2022)  10 - p. 5742-5748 , 2022
Link: https://doi.org/10.1109/..
 
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6

Design and Characterization of the Junction Isolation Struc..:

, In: 2022 International Electron Devices Meeting (IEDM),
Tsui, Bing-Yue ; Tsai, Te-Kai ; Hung, Chia-Lung. - p. 9.3.1-9.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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7

Dual Gate Oxide CMOS Process on 4H-SiC:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Tsui, Bing-Yue ; Hung, Chia-Lung ; Tsai, Te-Kai... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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8

High Voltage Gain 4H-SIC CMOS Technology Featuring LOCal Ox..:

, In: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Tsui, Bing-Yue ; Hung, Chia-Lung ; Jhuang, Ya-Ru... - p. 1-2 , 2021
Link: https://doi.org/10.1109/..
 
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9

Well-behaved 4H-SiC PMOSFET with LOCal oxidation of SiC (LO..:

Hung, Chia-Lung ; Tsui, Bing-Yue
Solid-State Electronics.  166 (2020)  - p. 107774 , 2020
Link: https://doi.org/10.1016/..
 
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10

Failure Analysis on TiAl Metallization Process for Ohmic Co..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Hung, Chia-Lung ; Cheng, Jung-Chien ; Tsui, Bing-Yue - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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11

Efficient pipelined architecture for competitive learning:

Li, Hui-Ya ; Hung, Chia-Lung ; Hwang, Wen-Jyi.
Journal of Parallel and Distributed Computing.  71 (2011)  2 - p. 236-244 , 2011
Link: https://doi.org/10.1016/..
 
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12

Plasma mediated ns-laser erosion of SiC monitored using Ram..:

Karnam, Dileep ; Rouhani, Mehdi ; Hobley, Jonathan...
Surfaces and Interfaces.  46 (2024)  - p. 104062 , 2024
Link: https://doi.org/10.1016/..
 
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13

Aluminum Parts Fabricated by Laser-Foil-Printing Additive M..:

Hung, Chia-Hung ; Li, Yingqi ; Sutton, Austin...
Materials.  13 (2020)  2 - p. 414 , 2020
Link: https://doi.org/10.3390/..
 
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14

Enhanced mechanical properties for 304L stainless steel par..:

Hung, Chia-Hung ; Sutton, Austin ; Li, Yingqi...
Journal of Manufacturing Processes.  45 (2019)  - p. 438-446 , 2019
Link: https://doi.org/10.1016/..
 
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15

Additive manufacturing of Zr-based metallic glass structure..:

Li, Yingqi ; Shen, Yiyu ; Hung, Chia-Hung..
Materials Science and Engineering: A.  729 (2018)  - p. 185-195 , 2018
Link: https://doi.org/10.1016/..
 
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