Hurtony, Tamás
48  Ergebnisse:
Personensuche X
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1

Board Level Underfill – Moisture Related Voids:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
 
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2

Study of Whisker Growth from SAC0307-SiC Composite Solder A..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
Choi, Halim ; Skwarek, Agata ; Hurtony, Tamas.. - p. 1-4 , 2023
 
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3

Influence of SiC reinforcement on microstructural and therm..:

Skwarek, Agata ; Illés, Balázs ; Górecki, Paweł...
Journal of Materials Research and Technology.  22 (2023)  - p. 403-412 , 2023
 
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4

Board Level Underfill – the Influence of Flux:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
 
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6

Tin Whisker Susceptibility of SAC0307-ZnO Composite Solder ..:

, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE),
 
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7

Suppression of Sn whisker growth from SnAgCu solder alloy w..:

Illés, Balázs ; Choi, Halim ; Hurtony, Tamás...
Journal of Materials Research and Technology.  20 (2022)  - p. 4231-4240 , 2022
 
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8

Impact of electromigration and isothermal ageing on lead-fr..:

Straubinger, Dániel ; Hurtony, Tamás ; Géczy, Attila
Journal of Materials Research and Technology.  21 (2022)  - p. 308-318 , 2022
 
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11

Kinetics of Sn whisker growth from Sn thin-films on Cu subs..:

Illés, Balázs ; Krammer, Olivér ; Hurtony, Tamás...
Journal of Materials Science: Materials in Electronics.  31 (2020)  19 - p. 16314-16323 , 2020
 
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13

Whisker Development from SAC0307-Mn07 Solder Alloy:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Illes, Balazs ; Batorfi, Reka ; Hurtony, Tamas... - p. 1-5 , 2020
 
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