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Ibitayo, Dimeji
6  Ergebnisse:
Personensuche X
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1

Transient Liquid Phase Bonding of AlN to AlSiC for Durable ..:

Pahinkar, Darshan G. ; Puckett, Waylon ; Graham, Samuel...
Advanced Engineering Materials.  20 (2018)  10 - p. , 2018
Link: https://doi.org/10.1002/..
 
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2

Experimental evaluation of metallic phase change materials ..:

Gonzalez-Nino, David ; Boteler, Lauren M. ; Ibitayo, Dimeji...
International Journal of Heat and Mass Transfer.  116 (2018)  - p. 512-519 , 2018
Link: https://doi.org/10.1016/..
 
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3

Kinetics of Dissolution and Isothermal Solidification for G..:

Rodriguez, Rogie I. ; Ibitayo, Dimeji ; Quintero, Pedro O.
Journal of Electronic Materials.  42 (2013)  8 - p. 2677-2685 , 2013
Link: https://doi.org/10.1007/..
 
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4

Investigation of Post-Etch Copper Residue on Direct Bonded ..:

Mei, Yunhui ; Lu, Guo-Quan ; Chen, Xu...
Journal of Electronic Materials.  40 (2011)  10 - p. 2119-2125 , 2011
Link: https://doi.org/10.1007/..
 
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5

Large-Area Chip Attachment by Sintering Nanosilver Paste: P..:

Xiao, Kewei ; Calata, Jesus ; Ngo, Khai..
Transactions of The Japan Institute of Electronics Packaging.  4 (2011)  1 - p. 101-109 , 2011
Link: https://doi.org/10.5104/..
 
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6

Performance of a dual, 1200 V, 400 A, silicon-carbide power..:

Urciuoli, Damian ; Green, Ronald ; Lelis, Aivars.
https://zenodo.org/record/1267549.  , 2010
Link: https://zenodo.org/recor..
 
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