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2024 International Conference on Electronics Packaging (ICEP) ,
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Physical and Thermal Characteristics of the Advanced Packag..:
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2023 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) ,
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AlGaN/GaN Schottky-Gate HEMTs with low thermal budget V/Al/..:
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2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) ,
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