Illés, Balázs
324  Ergebnisse:
Personensuche X
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2

Investigation of Sn grain growth in solder joints by numeri..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
 
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3

Influence of Reflow Temperature Profile on the Intermetalli..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
Dusek, Karel ; Vesely, Petr ; Busek, David... - p. 1-4 , 2024
 
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4

3D Printed and Electrospun, Transparent, Hierarchical Polyl..:

He, Haijun ; Gao, Min ; Illés, Balázs.
International Journal of Bioprinting.  6 (2024)  4 - p. 278 , 2024
 
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6

Development and Characterization of Sn99Ag0.3Cu0.7 -(ZrO2/C..:

, In: 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific),
Illes, Balazs ; Choi, Halim ; Illes, Balazs. - p. 1-8 , 2024
 
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8

Increasing Productivity in Vapour Phase Soldering Using Ver..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
 
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9

Effects of CuO nanoparticles on SAC composite solder joints..:

Illés, Balázs ; Choi, Halim ; Szostak, Krzysztof..
Journal of Materials Research and Technology.  32 (2024)  - p. 609-620 , 2024
 
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10

Increasing and testing the filtration efficiency of masks u..:

, In: 2023 IEEE Industry Applications Society Annual Meeting (IAS),
 
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12

Influence of SiC reinforcement on microstructural and therm..:

Skwarek, Agata ; Illés, Balázs ; Górecki, Paweł...
Journal of Materials Research and Technology.  22 (2023)  - p. 403-412 , 2023
 
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13

Study of Whisker Growth from SAC0307-SiC Composite Solder A..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
Choi, Halim ; Skwarek, Agata ; Hurtony, Tamas.. - p. 1-4 , 2023
 
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14

Reliability tests of the surface-mounted power MOSFETs sold..:

, In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
 
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