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Im, Hong Sik
7918  Ergebnisse:
Personensuche X
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1

Pedobacter riviphilus sp. nov., isolated from stream sedime..:

Im, Hong Sik ; Joung, Yochan ; Lee, Sang-Seob
International Journal of Systematic and Evolutionary Microbiology.  71 (2021)  9 - p. , 2021
Link: https://doi.org/10.1099/..
 
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2

God of Life, Lead Us to Justice and Peace: Reflection from ..:

Hong, In Sik
International Review of Mission.  102 (2013)  1 - p. 56-68 , 2013
Link: https://doi.org/10.1111/..
 
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3

Green growth policy in Korea:

, In: Climate change law / edited by Daniel A Farber (Sho Sato Professor of Law, University of California, Berkeley, USA), Marjan Peeters (Professor of Environmental Policy and Law, Maastricht University, the Netherlands)
Sang-Hyup, Kim ; Hong, Sik Cho. (2016)  - p. 515-532
Exemplar:  Juridicum: h jur 069.6 ad/150-1
 
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4

Modeling Wave Run-up along a Sloping or a Moving Wall Bound..:

K-H. Wang ; Ziping Dai ; Hong Sik Lee , 2011
Link: https://bioone.org/doi/1..
 
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5

X-Ray Absorption Near Edge Structure and X-Ray Diffraction ..:

Young-Sik Hong, Young-Sik Hong ; Jacques Darriet, Jacques Darriet ; Joo-Byoung Yoon, Joo-Byoung Yoon.
Japanese Journal of Applied Physics.  38 (1999)  3R - p. 1506 , 1999
Link: https://doi.org/10.1143/..
 
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6

Thermal Cycling Performance of Heterogeneous Solder Ball Jo..:

Bae, Joo Young ; Kim, Mi-Song ; Hyun, So-Hee...
Journal of Welding and Joining.  42 (2024)  2 - p. 174-183 , 2024
Link: https://doi.org/10.5781/..
 
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7

Effect of Spray-Type Alginate Hydrogel Dressing on Burn Wou..:

Choi, Jeong Yeon ; Joo, Yong-Joon ; Kang, Ri Jin..
Gels.  10 (2024)  2 - p. 152 , 2024
Link: https://doi.org/10.3390/..
 
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8

Power Cycling Reliability with Temperature Deviation of Pre..:

Hong, Won Sik ; Kim, Mi Song
JOM.  76 (2024)  6 - p. 2763-2771 , 2024
Link: https://doi.org/10.1007/..
 
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9

Bonding Characteristics of Solder and Sinter Joints on Acti..:

Kim, Mi-Song ; Hong, Won Sik ; Kim, Yong-Mo
Journal of Welding and Joining.  41 (2023)  6 - p. 558-565 , 2023
Link: https://doi.org/10.5781/..
 
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10

Bonding Property of Flip-Chip Chip-Scale Package with Vacuu..:

Hyun, So-Hee ; Lee, Hye Min ; Kim, Mi-Song.
Journal of Welding and Joining.  41 (2023)  5 - p. 387-395 , 2023
Link: https://doi.org/10.5781/..
 
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11

Usefulness of ultrasonography in diagnosis of intestinal ob..:

Kim, Yoon Soo ; Jung, Hyeon Joon ; Choi, Seo Yeol...
Pediatric Emergency Medicine Journal.  10 (2023)  1 - p. 45-48 , 2023
Link: https://doi.org/10.22470..
 
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12

Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball..:

Bae, Joo Young ; Kim, Mi-Song ; Lee, Hye Min...
Journal of Welding and Joining.  41 (2023)  5 - p. 379-386 , 2023
Link: https://doi.org/10.5781/..
 
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13

Electrochemical Metallic Ion Migration Property of Multi-La..:

Hong, Won Sik ; Kim, Mi-Song ; Bae, Joo Young...
Journal of Welding and Joining.  41 (2023)  6 - p. 519-527 , 2023
Link: https://doi.org/10.5781/..
 
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14

In-situ Observation and Modeling of Intermetallic Compound ..:

Yu, Jieun ; Choi, Myeonghwan ; Yu, Dong-Yurl...
Electronic Materials Letters.  19 (2023)  3 - p. 229-238 , 2023
Link: https://doi.org/10.1007/..
 
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15

Solder Joint Degradation and Electrochemical Metallic Ion M..:

Lee, Hye Min ; Kim, Mi-Song ; Hong, Won Sik
Journal of Welding and Joining.  41 (2023)  4 - p. 265-274 , 2023
Link: https://doi.org/10.5781/..
 
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