Ishikawa, Dai
279  Ergebnisse:
Personensuche X
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1

Large Area Powermodule Sintering Using Porous Copper:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Blank, Thomas ; Steiner, Felix ; Ishikawa, Dai. - p. 43-44 , 2024
 
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4

Comparison of Mechanical Property and Thermal Cycling Lifet..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Ishikawa, Dai ; Nakako, Hideo ; Blank, Thomas. - p. 313-314 , 2024
 
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5

Dendrite Formation in Power Electronics Packages during HV-..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Steiner, Felix ; Blank, Thomas ; Ishikawa, Dai. - p. 31-32 , 2024
 
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11

Copper and silver sintered die-attach compared in HV-H3TRB ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Steiner, Felix ; Ishikawa, Dai ; Nakako, Hideo. - p. 89-90 , 2023
 
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14

Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Pow..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Tsai, Chin-Hao ; Steiner, Felix ; Ishikawa, Dai.. - p. 97-98 , 2023
 
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15

Adhesive Strength and Diffusion at Interfaces between Sinte..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Ishikawa, Dai ; Nakako, Hideo ; Blank, Thomas.. - p. 233-234 , 2023
 
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