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2024 International Conference on Electronics Packaging (ICEP) ,
1
Large Area Powermodule Sintering Using Porous Copper:
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2024 International Conference on Electronics Packaging (ICEP) ,
4
Comparison of Mechanical Property and Thermal Cycling Lifet..:
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2024 International Conference on Electronics Packaging (ICEP) ,
5
Dendrite Formation in Power Electronics Packages during HV-..:
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2023 International Conference on Electronics Packaging (ICEP) ,
11
Copper and silver sintered die-attach compared in HV-H3TRB ..:
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2023 International Conference on Electronics Packaging (ICEP) ,
14
Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Pow..:
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2023 International Conference on Electronics Packaging (ICEP) ,
15