Ismail, Adlil Aizat
9  Ergebnisse:
Personensuche X
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1

Laser Rework Process for Efficient Lead-Free Solder Joints ..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Jalar, Azman...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  4 - p. 735-742 , 2024
 
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2

Undissolved gold in fine-pitch BGA solder joint under therm..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Jalar, Azman...
Journal of Materials Science: Materials in Electronics.  35 (2024)  12 - p. , 2024
 
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3

Thermal Management on the Solder Joints of Adjacent Ball Gr..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
 
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4

Cardinal and Ordinal Directions Approach in Investigating A..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Ehsan, Abang Annuar...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  9 - p. 1492-1501 , 2022
 
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5

Intermetallic Compound Thickness of Ball Grid Array Solder ..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
 
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7

Effects of Underfill Materials on Behavior of Intermetallic..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
 
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