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Jaafar, Norhanani
16  Ergebnisse:
Personensuche X
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1

Through Mold Vertical Interconnect Formation in FOWLP using..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Siew Boon, Serine Soh ; David Ho, Soon Wee ; Jaafar, Norhanani - p. 125-128 , 2023
Link: https://doi.org/10.1109/..
 
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2

Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bond..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Kiat Goh, Simon Chun ; Hemanth Kumar, Cheemalamarri ; Hu, Liangxing... - p. 404-408 , 2023
Link: https://doi.org/10.1109/..
 
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3

Process Development and Integration on Si Substrate for Ion..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Li, H. Y. ; Liu Huihong, Clarence ; Jaafar, Norhanani... - p. 253-256 , 2023
Link: https://doi.org/10.1109/..
 
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4

CMOS AlN and ScAlN Pyroelectric Detectors with Optical Enha..:

Ng, Doris Keh Ting ; Xu, Linfang ; Fu, Yuan Hsing...
Advanced Electronic Materials.  9 (2023)  8 - p. , 2023
Link: https://doi.org/10.1002/..
 
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5

Miniaturized CO2 Gas Sensor Using 20% ScAlN-Based Pyroelect..:

Ng, Doris Keh Ting ; Xu, Linfang ; Chen, Weiguo...
ACS Sensors.  7 (2022)  8 - p. 2345-2357 , 2022
Link: https://doi.org/10.1021/..
 
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6

3D Cryogenic Interposer for Quantum Computing Application:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Li, Hongyu ; Lau, Aaron Chit Siong ; Jaafar, Norhanani... - p. 1546-1550 , 2022
Link: https://doi.org/10.1109/..
 
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7

NDIR CO2 gas sensing using CMOS compatible MEMS ScAlN-based..:

Ng, Doris Keh Ting ; Ho, Chong Pei ; Xu, Linfang...
Sensors and Actuators B: Chemical.  346 (2021)  - p. 130437 , 2021
Link: https://doi.org/10.1016/..
 
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8

Development of wafer level solderball placement process for..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Jaafar, Norhanani ; Chong, Ser Choong.. - p. 435-439 , 2020
Link: https://doi.org/10.1109/..
 
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9

Development of 2.5D high density device on large ultra-thin..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Chidambaram, Vivek ; Jaafar, Norhanani. - p. 247-252 , 2019
Link: https://doi.org/10.1109/..
 
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10

Indium-based Flip-chip Interconnect for Cryogenic Packaging:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Jaafar, Norhanani Binte ; Hongyu, Li ; Choong, Chong Ser... - p. 970-973 , 2023
Link: https://doi.org/10.1109/..
 
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11

Investigation of SnAg Superconductivity as Solder Material ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Ng, Yong Chyn ; Li, Hongyu ; Jaafar, Norhanani Binte... - p. 227-230 , 2023
Link: https://doi.org/10.1109/..
 
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12

Establishment of Highly Dense Wire Bonding with Insulated A..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Jaafar, Norhanani Binte ; Choong, Chong Ser - p. 352-356 , 2022
Link: https://doi.org/10.1109/..
 
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13

Thermal Aging and Ball Shear Characterization of SAC-X Sold..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Jaafar, Norhanani Binte ; Choong, Chong Ser ; Siang, Sharon Lim Pei. - p. 321-325 , 2020
Link: https://doi.org/10.1109/..
 
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14

Comprehensive Study of Tin-Silver-Copper Lead-Free Alloys o..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Jaafar, Norhanani Binte ; Choong, Chong Ser - p. 658-662 , 2019
Link: https://doi.org/10.1109/..
 
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15

Miniaturized CO(2) Gas Sensor Using 20% ScAlN-Based Pyroele..:

Ng, Doris Keh Ting ; Xu, Linfang ; Chen, Weiguo...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9425554/.  , 2022
Link: http://www.ncbi.nlm.nih...
 
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