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X
Jalar, A
145  Ergebnisse:
Personensuche X
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1

Sustainable substrate tin oxide/nanofibril cellulose/thermo..:

Azra, N.A. ; Atiqah, A. ; Jalar, A....
Journal of Materials Research and Technology.  26 (2023)  - p. 99-108 , 2023
Link: https://doi.org/10.1016/..
 
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2

A systematic literature review: The effects of surface roug..:

Ismail, N. ; Atiqah, A. ; Jalar, A....
Journal of Manufacturing Processes.  83 (2022)  - p. 68-85 , 2022
Link: https://doi.org/10.1016/..
 
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3

Flux Modification for Wettability and Reliability Improveme..:

, In: Recent Progress in Lead-Free Solder Technology; Topics in Mining, Metallurgy and Materials Engineering,
Ismail, N. ; Jalar, A. ; Bakar, M. A.. - p. 195-216 , 2022
Link: https://doi.org/10.1007/..
 
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4

Thermal cycling effect on the crack formation of solder joi..:

Suhaimi, M. F. ; Abu Bakar, M. ; Jalar, A...
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012006 , 2022
Link: https://doi.org/10.1088/..
 
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5

Advancement of Printed Circuit Board (PCB) Surface Finishes..:

, In: Recent Progress in Lead-Free Solder Technology; Topics in Mining, Metallurgy and Materials Engineering,
Atiqah, A. ; Jalar, A. ; Bakar, M. A.. - p. 217-238 , 2022
Link: https://doi.org/10.1007/..
 
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6

Contributors:

, In: Industrial Applications of Nanocellulose and Its Nanocomposites,
Abd-Rahim, Nur Farisha ; Asa'ari, Ainun Zuriyati Mohamed ; Aisyah, H.A.... - p. xiii-xx , 2022
Link: https://doi.org/10.1016/..
 
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7

Significance of Intermetallic Compound (IMC) Layer to the R..:

, In: Recent Progress in Lead-Free Solder Technology; Topics in Mining, Metallurgy and Materials Engineering,
Bakar, M. A. ; Jalar, A. ; Atiqah, A.. - p. 239-263 , 2022
Link: https://doi.org/10.1007/..
 
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8

Investigation of integrated factors in the occurrence of co..:

Hamid, K. A. ; Badarisman, A. H. ; Jalar, A..
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012016 , 2022
Link: https://doi.org/10.1088/..
 
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9

Nanocellulose composites for electronic applications:

, In: Industrial Applications of Nanocellulose and Its Nanocomposites,
Atiqah, A. ; Sabaruddin, F.A. ; Ismail, N.... - p. 481-502 , 2022
Link: https://doi.org/10.1016/..
 
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10

Effects of electrolyte towards copper wire metallurgical in..:

Abdul Hamid, K. ; Badarisman, A. H. ; Jalar, A..
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012013 , 2022
Link: https://doi.org/10.1088/..
 
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11

Effects of molding temperature on delamination of small out..:

Badarisman, A. H. ; Abdul Hamid, K. ; Ideris, H...
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012035 , 2022
Link: https://doi.org/10.1088/..
 
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12

Advanced Assembly of Miniaturized Surface Mount Technology ..:

, In: Recent Progress in Lead-Free Solder Technology; Topics in Mining, Metallurgy and Materials Engineering,
Ani, F. C. ; Saad, A. A. ; Jalar, A.... - p. 113-131 , 2022
Link: https://doi.org/10.1007/..
 
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13

Reduce Wafer Remnants Through Pre-Assembly Process Optimiza..:

Vijayakumaran, P. ; Ramli, M. H. M. ; Selvam, M....
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012001 , 2022
Link: https://doi.org/10.1088/..
 
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14

Effect of stencil wall aperture on solder paste release via..:

Mohamed Sunar, M. S. ; Abu Bakar, M. ; Jalar, A...
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012037 , 2022
Link: https://doi.org/10.1088/..
 
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15

Influence of Copper Substrate Roughness on the Growth of In..:

Atiqah, A. ; Rahim, R.A.A.A. ; Jalar, A..
Journal of Physics: Conference Series.  2169 (2022)  1 - p. 012015 , 2022
Link: https://doi.org/10.1088/..
 
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