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Jalar, Azman
93  Ergebnisse:
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1

Laser Rework Process for Efficient Lead-Free Solder Joints ..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Jalar, Azman...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  4 - p. 735-742 , 2024
Link: https://doi.org/10.1109/..
 
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2

Micromechanical and microstructure evolution of leaded (SnP..:

Zulkifli, Muhammad Nubli ; Abdullah, Izhan ; Azhan, Nurul Hanis.
Journal of Adhesion Science and Technology.  , 2024
Link: https://doi.org/10.1080/..
 
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3

Undissolved gold in fine-pitch BGA solder joint under therm..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Jalar, Azman...
Journal of Materials Science: Materials in Electronics.  35 (2024)  12 - p. , 2024
Link: https://doi.org/10.1007/..
 
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4

Titanium dioxide ion-sensitive extended gate field effect t..:

Al-Hardan, Naif H. ; Hamid, Muhammad Azmi Abdul ; Firdaus-Raih, Mohd...
Journal of Materials Science: Materials in Electronics.  35 (2024)  5 - p. , 2024
Link: https://doi.org/10.1007/..
 
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5

Linear growth behaviour of intermetallic compound layer in ..:

Bakar, Maria Abu ; Jalar, Azman ; Alias, Anuar
Science and Technology of Welding and Joining.  29 (2024)  1 - p. 38-46 , 2024
Link: https://doi.org/10.1177/..
 
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6

Effect of ultrasonic bonding and lamination on electrical p..:

Basher, Hassan ; Zulkifli, Muhammad Nubli ; Jalar, Azman.
Journal of Adhesion Science and Technology.  , 2024
Link: https://doi.org/10.1080/..
 
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7

Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar P..:

Hamid, Sabarina Abdul ; Zulkifli, Muhammad Nubli ; Jalar, Azman...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  6 - p. 1123-1133 , 2024
Link: https://doi.org/10.1109/..
 
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8

Thermal Management on the Solder Joints of Adjacent Ball Gr..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
Ismail, Adlil Aizat ; Abu Bakar, Maria ; Ehsan, Abang Annuar... - p. 103-113 , 2023
Link: https://doi.org/10.1007/..
 
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9

Study on Forming and Properties of Heat Resistant Low Expan..:

, In: 2023 International Conference on Mechatronics, IoT and Industrial Informatics (ICMIII),
Li, Zhiyong ; Jalar, Azman - p. 292-296 , 2023
Link: https://doi.org/10.1109/..
 
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10

Proceedings of the 7th International Corrosion Prevention S.. 

Lecture Notes in Mechanical Engineering
Jalar, Azman ; Embong, Zaidi ; Othman, Norinsan Kamil.. - 1st ed. 2023 . , 2023
Link: https://doi.org/10.1007/..
 
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11

Effect of Die Deflection during Au Wire Bonding Process on ..:

Azahar, Ahmad Zarif ; Bakar, Maria Abu ; Jalar, Azman.
Journal of Materials Engineering and Performance.  , 2023
Link: https://doi.org/10.1007/..
 
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12

Effect of Ultrasonic Process Parameter on Resistance and Pl..:

, In: TENCON 2023 - 2023 IEEE Region 10 Conference (TENCON),
Hamid, Sabarina Abdul ; Zulkifli, Muhammad Nubli ; Jalar, Azman... - p. 1288-1292 , 2023
Link: https://doi.org/10.1109/..
 
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13

Dynamic precipitation and dynamic recrystallization behavio..:

Wang, Linghao ; Jalar, Azman ; Dan, Longhong
Journal of Materials Research and Technology.  26 (2023)  - p. 7634-7648 , 2023
Link: https://doi.org/10.1016/..
 
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14

Measurement of Aluminium Remnant Thickness on Copper Wire B..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Supramaniam, Saraswathy ; Periasamy, Subashini ; Nurhisham, Muhammad.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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15

Effect of Thermomechanical Treatment on Microstructural and..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
Mohd Yusoff, Fateh Amera ; Abu Bakar, Maria ; Jalar, Azman - p. 133-144 , 2023
Link: https://doi.org/10.1007/..
 
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