E-LIB Suche - Ergebnisse für: Jeannin, Pierre-Olivier

1

Advanced voltage balancing techniques for series-connected ..:

Alves, Luciano F.S. ; Lefranc, Pierre ; Jeannin, Pierre-Olivier.
Power Electronic Devices and Components. 7 (2024) - p. 100055 , 2024

Link: https://doi.org/10.1016/..

2

Flip-Chip Low inductive and EMC optimized PCB Power Module:

, In: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC),

Abed Ali, Fatme ; Jeannin, Pierre-Olivier ; Avenas, Yvan. - p. 1534-1538 , 2024

Link: https://doi.org/10.1109/..

3

Sustainable printed circuit board substrates based on flame..:

Farkas, Csaba ; Gál, László ; Csiszár, András...
Sustainable Materials and Technologies. 40 (2024) - p. e00902 , 2024

Link: https://doi.org/10.1016/..

4

High-Speed Digital Electronics Board on a Novel Biobased an..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),

Grennerat, Vincent ; Xavier, Pascal ; Jeannin, Pierre-Olivier.. - p. 1-5 , 2023

Link: https://doi.org/10.1109/..

5

EMI Mitigation of GaN Power Inverter Leg by Local Shielding..:

Derkacz, Pawel B. ; Schanen, Jean-Luc ; Jeannin, Pierre-Olivier...
IEEE Transactions on Power Electronics. 37 (2022) 10 - p. 11996-12004 , 2022

Link: https://doi.org/10.1109/..

6

Optimization of a Gate Distribution Layout to Compensate th..:

Nakahata-Medrado, Andressa ; Schanen, Jean-Luc ; Guichon, Jean-Michel...
Energies. 14 (2021) 7 - p. 1891 , 2021

Link: https://doi.org/10.3390/..

7

A New Gate Drive Power Supply Configuration for Common Mode..:

Alves, Luciano F. S. ; Lefranc, Pierre ; Jeannin, Pierre-Olivier.
IEEE Transactions on Power Electronics. 36 (2021) 4 - p. 4081-4090 , 2021

Link: https://doi.org/10.1109/..

8

Analysis of the Multi-Steps Package (MSP) for Series-Connec..:

Alves, Luciano F. S. ; Lefranc, Pierre ; Jeannin, Pierre-Olivier..
Electronics. 9 (2020) 9 - p. 1341 , 2020

Link: https://doi.org/10.3390/..

9

3D PCB package for GaN inverter leg with low EMC feature:

, In: 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe),

Derkacz, Pawel B. ; Schanen, Jean-Luc ; Jeannin, Pierre-Olivier... - p. P.1-P.10 , 2020

Link: https://doi.org/10.23919..

10

Diamond semiconductor performances in power electronics app..:

Perez, Gaëtan ; Maréchal, Aurélien ; Chicot, Gauthier...
Diamond and Related Materials. 110 (2020) - p. 108154 , 2020

Link: https://doi.org/10.1016/..

11

A Novel Self Oscillating Class Phi2 Inverter Topology:

, In: 2018 2nd European Conference on Electrical Engineering and Computer Science (EECS),

Makhoul, Rawad ; Maynard, Xavier ; Perichon, Pierre... - p. 7-10 , 2018

Link: https://doi.org/10.1109/..

12

Integrated temperature sensor with diamond Schottky diodes ..:

Perez, Gaëtan ; Chicot, Gauthier ; Avenas, Yvan...
Diamond and Related Materials. 78 (2017) - p. 83-87 , 2017

Link: https://doi.org/10.1016/..

13

SIC power devices in power electronics: An overview:

, In: 2017 Brazilian Power Electronics Conference (COBEP),

Alves, Luciano F. S. ; Gomes, Ruan C. M. ; Lefranc, Pierre... - p. 1-8 , 2017

Link: https://doi.org/10.1109/..

14

Above 2000 V breakdown voltage at 600 K GaN-on-silicon high..:

Herbecq, Nicolas ; Roch-Jeune, Isabelle ; Linge, Astrid...
physica status solidi (a). 213 (2016) 4 - p. 873-877 , 2016

Link: https://doi.org/10.1002/..

15

Design of an Integrated Power Module for Silicon Carbide MO..:

Abed Ali, Fatme ; Avenas, Yvan ; Lefranc, Pierre...
Materials Science Forum. 1062 (2022) - p. 637-641 , 2022

Link: https://doi.org/10.4028/..