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Jeong, Haksan
20  Ergebnisse:
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1

Effect of thickness in the SAC 305 plated layer on the inte..:

Son, Jae-yeol ; Kang, Donggil ; Jeong, Haksan.
Journal of Materials Science: Materials in Electronics.  35 (2024)  7 - p. , 2024
Link: https://doi.org/10.1007/..
 
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2

Enhancing Board-Level Drop Impact Reliability through Epoxy..:

Noh, Taejoon ; Jeong, Haksan ; Jung, Seung-Boo
IEEE Transactions on Components, Packaging and Manufacturing Technology.  , 2024
Link: https://doi.org/10.1109/..
 
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3

Effect of Ceramic Filler in Epoxy Mold Compound on Thermome..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Noh, Taejoon ; Jeong, Haksan ; Jung, Seung-boo - p. 2029-2033 , 2023
Link: https://doi.org/10.1109/..
 
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4

RF Characterization in Range of 18GHz in Fan-out Package St..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ha, Eun ; Jeong, Haksan ; Min, Kyung Deuk.. - p. 2002-2007 , 2022
Link: https://doi.org/10.1109/..
 
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5

Mechanical Properties of Cu-Core Solder Balls with ENEPIG S..:

Jeong, Haksan ; Lee, Choong-Jae ; Min, Kyung Deuk..
Journal of Electronic Materials.  49 (2020)  10 - p. 6073-6079 , 2020
Link: https://doi.org/10.1007/..
 
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6

Electromigration Behavior of Cu Core Solder Joints Under Hi..:

Jeong, Haksan ; Lee, Choong-Jae ; Kim, Jae-Ha..
Electronic Materials Letters.  16 (2020)  6 - p. 513-519 , 2020
Link: https://doi.org/10.1007/..
 
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7

Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pul..:

Jung, Kwang-Ho ; Min, Kyung Deuk ; Lee, Choong-Jae...
Advanced Engineering Materials.  22 (2020)  12 - p. , 2020
Link: https://doi.org/10.1002/..
 
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8

Effect of epoxy mold compound and package dimensions on the..:

Jeong, Haksan ; Jung, Kwang-Ho ; Lee, Choong-Jae...
Journal of Materials Science: Materials in Electronics.  31 (2020)  9 - p. 6835-6842 , 2020
Link: https://doi.org/10.1007/..
 
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9

Fabrication of Novel Ag Flake Composite Films Using a CMC/P..:

Lee, Choong-Jae ; Hwang, Byeong-Uk ; Jeong, Haksan..
Electronic Materials Letters.  16 (2020)  4 - p. 332-339 , 2020
Link: https://doi.org/10.1007/..
 
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10

Transient Liquid Phase Sintering of Ni and Sn-58Bi on Micro..:

Min, Kyung Deuk ; Jung, Kwang-Ho ; Lee, Choong-Jae...
Electronic Materials Letters.  16 (2020)  4 - p. 347-354 , 2020
Link: https://doi.org/10.1007/..
 
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11

Mechanical reliability of Cu cored solder ball in flip chip..:

Jeong, Haksan ; Min, Kyung Deuk ; Lee, Choong-Jae..
Microelectronics Reliability.  112 (2020)  - p. 113918 , 2020
Link: https://doi.org/10.1016/..
 
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12

The Fabrication of Ni-MWCNT Composite Solder and Its Reliab..:

Lee, Choong-Jae ; Min, Kyung Deuk ; Jeong, Haksan..
Journal of Electronic Materials.  49 (2020)  11 - p. 6746-6753 , 2020
Link: https://doi.org/10.1007/..
 
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13

Thermal and mechanical property of FCLED package component ..:

Lee, Choong-Jae ; Jeong, Haksan ; Jung, Kwang-Ho..
Journal of Materials Science: Materials in Electronics.  30 (2019)  14 - p. 12869-12875 , 2019
Link: https://doi.org/10.1007/..
 
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14

Mechanical property of new concept about Cu core bump forma..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Son, J.Y. ; Jeong, Haksan ; Lee, S.G... - p. 431-434 , 2019
Link: https://doi.org/10.1109/..
 
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15

Thermomechanical Properties of Fan-Out Wafer Level Package ..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Jeong, Haksan ; Jung, Kwang-Ho ; Lee, Choong-Jae.. - p. 1-5 , 2019
Link: https://doi.org/10.23919..
 
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