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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
1
Process Development and Integration for Wafer-to-Wafer Hybr..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
2
Cu CMP Dishing Control for Fine Pitch Wafer-to-Wafer (W2W) ..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
3
Bonding integrity enhancement in wafer to wafer fine pitch ..:
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2009 11th Electronics Packaging Technology Conference ,
5
Design of a fully-enclosed disposable bio-micro fluidic car..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
10
Ultrathin New Dielectric Interlayer Layer - Enhancer for TE..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
11
Optimization of the CMP process for direct wafer-to-wafer o..:
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2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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