Ji, Xiaoxiao
789  Ergebnisse:
Personensuche X
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2

Adverse childhood experiences and mental health disorder in..:

Ma, Ning ; Ji, Xiaoxiao ; Shi, Yixin...
Journal of Affective Disorders.  355 (2024)  - p. 22-30 , 2024
 
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4

Optical, electrical, and mechanical reliability of 1700 PPI..:

Wang, Kefeng ; Chen, Zehua ; Zhou, Haojie...
Microelectronics Reliability.  158 (2024)  - p. 115431 , 2024
 
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5

A neural pathway for social modulation of spontaneous locom..:

Zhao, Huan ; Jiang, Xinyu ; Ma, Mingze...
Proceedings of the National Academy of Sciences.  121 (2024)  9 - p. , 2024
 
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6

Investigating the Performance and Reliability of Au-Sn Bond..:

Yin, Luqiao ; Zhou, Haojie ; Ji, Xiaoxiao...
IEEE Transactions on Electron Devices.  71 (2024)  3 - p. 1999-2004 , 2024
 
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7

High Resolution Micro-LED Arrays Using Au–Sn Flip-Chip Bond..:

Zhou, Haojie ; Wang, Kefeng ; Ji, Xiaoxiao..
IEEE Transactions on Electron Devices.  70 (2023)  6 - p. 3140-3144 , 2023
 
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8

3400 PPI Active-Matrix Monolithic Blue and Green Micro-LED ..:

Ji, Xiaoxiao ; Wang, Fei ; Zhou, Haojie...
IEEE Transactions on Electron Devices.  70 (2023)  9 - p. 4689-4693 , 2023
 
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9

Hybrid bonding thermodynamic simulation of 3×3 array of Mic..:

, In: 2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS),
Li, Jianxin ; Zhou, Haojie ; Ji, Xiaoxiao.. - p. 330-332 , 2023
 
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10

Quantum Dot Color Conversion Characteristics and Performanc..:

Lin, Pengsen ; Ji, Xiaoxiao ; Wang, Xinyi..
IEEE Transactions on Electron Devices.  70 (2023)  7 - p. 3684-3689 , 2023
 
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11

Enhancing and toughening bamboo interfacial bonding strengt..:

Wang, Jinhui ; Wang, Ruisong ; Ji, Xiaoxiao..
Journal of Materials Research and Technology.  26 (2023)  - p. 8213-8228 , 2023
 
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12

Fabrication and Study of Micro-LED Quantum Dot Color Conver..:

, In: 2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS),
Wang, Xinyi ; Zhou, Haojie ; Ji, Xiaoxiao.. - p. 326-329 , 2023
 
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15

Influences of bonding process parameters on mechanical prop..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Kefeng ; Zhong, Han ; Chen, Zehua... - p. 1-4 , 2023
 
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