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X
Jiang, Maogong
23  Ergebnisse:
Personensuche X
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1

Optimization Method and Simulation Verification of Capaciti..:

, In: 2023 IEEE 3rd International Conference on Electronic Technology, Communication and Information (ICETCI),
Li, Peilei ; Gu, Chongyang ; Jiang, Maogong... - p. 140-144 , 2023
Link: https://doi.org/10.1109/..
 
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2

Remaining Useful Life Prediction of IGBT Module Based on Pa..:

, In: 2022 Prognostics and Health Management Conference (PHM-2022 London),
Jiang, Maogong ; Lv, Qianqian ; Li, Peilei... - p. 132-135 , 2022
Link: https://doi.org/10.1109/..
 
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3

Research on Intelligent Selection Algorithm of Aerospace Co..:

, In: 2022 IEEE International Conference on Advances in Electrical Engineering and Computer Applications (AEECA),
Gu, Chongyang ; Jiang, Maogong ; Li, Peilei... - p. 369-373 , 2022
Link: https://doi.org/10.1109/..
 
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4

An Online Remaining Life Prediction Method Based on Nonline..:

, In: 2022 4th International Conference on Frontiers Technology of Information and Computer (ICFTIC),
Fan, XiaoMing ; Zhang, JiaQi ; Jiang, ChengZhi... - p. 617-625 , 2022
Link: https://doi.org/10.1109/..
 
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5

Research on IGBT Bonding Wires Crack Propagation at the Mac..:

Luo, Jun ; Guan, Shukai ; Wan, Bo..
IEEE Access.  9 (2021)  - p. 106270-106282 , 2021
Link: https://doi.org/10.1109/..
 
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6

Research on sintering process and thermal conductivity of h..:

Zhang, Zhongqing ; Fu, Guicui ; Wan, Bo..
Microelectronics Reliability.  126 (2021)  - p. 114203 , 2021
Link: https://doi.org/10.1016/..
 
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7

Failure Analysis of SAC305 Ball Grid Array Solder Joint at ..:

Li, Yanruoyue ; Fu, Guicui ; Wan, Bo...
Applied Sciences.  10 (2020)  6 - p. 1951 , 2020
Link: https://doi.org/10.3390/..
 
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8

Damage based PoF model of solder joints under temperature c..:

Yuan, Jiaxin ; Zhang, Sujuan ; Wan, Bo..
Microelectronics Reliability.  114 (2020)  - p. 113814 , 2020
Link: https://doi.org/10.1016/..
 
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9

Storage PoF model of electromagnetic relays based on electr..:

Guo, Wendi ; Fu, Guicui ; Wan, Bo..
Microelectronics Reliability.  100-101 (2019)  - p. 113381 , 2019
Link: https://doi.org/10.1016/..
 
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10

Finite Element Modeling of IGBT Modules to Explore the Corr..:

, In: 2019 IEEE Energy Conversion Congress and Exposition (ECCE),
Jiang, Maogong ; Fu, Guicui ; Ceccarelli, Lorenzo... - p. 839-844 , 2019
Link: https://doi.org/10.1109/..
 
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11

Wear-out evolution analysis of multiple-bond-wires power mo..:

Jiang, Maogong ; Fu, Guicui ; Fogsgaard, Martin Bendix...
Microelectronics Reliability.  100-101 (2019)  - p. 113472 , 2019
Link: https://doi.org/10.1016/..
 
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12

Risk assessment for bonding wires instantaneous touch in hi..:

Ma, Cheng ; Zhang, Sujuan ; Fu, Guicui...
Journal of Physics: Conference Series.  1074 (2018)  - p. 012043 , 2018
Link: https://doi.org/10.1088/..
 
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13

Counterfeit identification method of plastic encapsulated m..:

Qiu, Yao ; Zhang, SuJuan ; Chen, ZhengPing..
Journal of Physics: Conference Series.  1074 (2018)  - p. 012102 , 2018
Link: https://doi.org/10.1088/..
 
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14

Failure analysis of solder layer in power transistor:

Jiang, Maogong ; Fu, Guicui ; Wan, Bo...
Soldering & Surface Mount Technology.  30 (2018)  1 - p. 49-56 , 2018
Link: https://doi.org/10.1108/..
 
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15

Research on IGBT Bonding Wires Crack Propagation at the Mac..:

Jun Luo ; Shukai Guan ; Bo Wan..
https://ieeexplore.ieee.org/document/9492076/.  , 2021
Link: https://doi.org/10.1109/..
 
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