Jiang, Wen-Chinq
4  Ergebnisse:
Personensuche X
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2

A Heterogeneously Integrated Wafer-level Processed Co-Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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3

A Novel Packaging Platform for High-Performance Optical Eng..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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