Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Jiao, Binbin
392  Ergebnisse:
Personensuche X
?
1

Near-Junction Thermal Management of GaN-on-SiC MMIC Power A..:

Lu, Dichen ; Ye, Yuxin ; Liu, Ruiwen...
IEEE Transactions on Electron Devices.  71 (2024)  1 - p. 502-509 , 2024
Link: https://doi.org/10.1109/..
 
?
2

The study of heat characteristics for micro pin-fin heat si..:

Kuang, Nailiang ; Lu, Guoran ; Li, Kui...
Thermal Science.  28 (2024)  2 Part A - p. 889-901 , 2024
Link: https://doi.org/10.2298/..
 
?
3

An adaptive thermal management method via bionic sweat pore..:

Yu, Lihang ; Jiao, Binbin ; Ye, Yuxin...
Applied Thermal Engineering.  247 (2024)  - p. 122953 , 2024
Link: https://doi.org/10.1016/..
 
?
4

Low Stress TSV Arrays for High-Density Interconnection:

Jiao, Binbin ; Qiao, Jingping ; Jia, Shiqi...
Engineering.  , 2024
Link: https://doi.org/10.1016/..
 
?
5

Liposomal Neostigmine Bromide: A Localized Therapeutic Appr..:

Liu, Kunpeng ; Gong, Haitao ; Jiao, Binbin...
Advanced NanoBiomed Research.  , 2024
Link: https://doi.org/10.1002/..
 
?
6

A Highly Sensitive Dual-Mode Thermal Flow Sensor Based on C..:

Qiao, Jingping ; Chen, Jingyu ; Jiao, Binbin...
IEEE Sensors Journal.  24 (2024)  2 - p. 1245-1254 , 2024
Link: https://doi.org/10.1109/..
 
?
7

Investigation on the unconstrained microfluidic heat sink w..:

Yu, Lihang ; Ye, Yuxin ; Wang, Zhenyu...
Thermal Science.  28 (2024)  2 Part A - p. 877-888 , 2024
Link: https://doi.org/10.2298/..
 
?
8

Design of Thermal Conductivity Gas Sensor with Silicon Cap:

, In: 2023 IEEE 16th International Conference on Electronic Measurement & Instruments (ICEMI),
Wang, Changchun ; Jiao, Binbin ; Liu, Xin... - p. 204-208 , 2023
Link: https://doi.org/10.1109/..
 
?
9

Prognostic value of the systemic immune-inflammation index ..:

Luo, Zhenkai ; Yan, Yangxuanyu ; Jiao, Binbin...
World Journal of Surgical Oncology.  21 (2023)  1 - p. , 2023
Link: https://doi.org/10.1186/..
 
?
10

Low-stress TSVs for high-density 3D integration:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Qiao, Jingping ; Jiao, Binbin ; Jia, Shiqi... - p. 606-611 , 2023
Link: https://doi.org/10.1109/..
 
?
11

Embedded manifold cooling for efficient thermal management ..:

, In: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS),
Du, Xiangbin ; Ye, Yuxin ; Kong, Yanmei... - p. 209-212 , 2023
Link: https://doi.org/10.1109/..
 
?
12

Wearable Multi-Channel Pulse Signal Acquisition System Base..:

Kang, Xiaoxiao ; Huang, Lin ; Zhang, Yitao...
Biomimetics.  8 (2023)  2 - p. 207 , 2023
Link: https://doi.org/10.3390/..
 
?
13

Risk factors for extraurothelial recurrence in upper tract ..:

Luo, Zhenkai ; Jiao, Binbin ; Yan, Yangxuanyu...
Frontiers in Oncology.  13 (2023)  - p. , 2023
Link: https://doi.org/10.3389/..
 
?
14

Investigation on the heat dissipation of high heat flux chi..:

Cong, Bo ; Liu, Ruiwen ; Ye, Yuxin...
Thermal Science.  27 (2023)  1 Part B - p. 869-880 , 2023
Link: https://doi.org/10.2298/..
 
?
15

Experimental Investigations on Thermal Superposition Effect..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Ye, Yuxin ; Du, Xiangbin ; Kong, Yanmei... - p. 1017-1021 , 2023
Link: https://doi.org/10.1109/..
 
1-15