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2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) ,
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Thermal characterization of a ceramic baseplate-less 10 kV ..:
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2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) ,
4
Design Consideration of an Isolated Gate Driver With Discre..:
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2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) ,
5
Electro-Thermal Digital Twin for GaN eHEMT Power Modules Te..:
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2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) ,
6
Suppressing Inter-module Oscillations for Paralleled 10 kV ..:
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2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) ,
7
Compensated Power Sensor for Semiconductor Switching Loss M..:
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2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) ,
8
Temperature distribution of 10 kV and 15 kV SiC-MOSFETs wit..:
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2023 IEEE Energy Conversion Congress and Exposition (ECCE) ,
9
Ultra-Fast Power Module Inductance Estimation using Convolu..:
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2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) ,
10
Thermal cycling characterization of integrated GaN power mo..:
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2023 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
11
Heat cycle failure point prediction by 3D thermal stress an..:
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2023 IEEE Energy Conversion Congress and Exposition (ECCE) ,
12
Dynamic Current Sharing Optimization of Asymmetric SiC Powe..:
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2023 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
13
Demonstration of a Class E push-pull resonant inverter for ..:
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2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) ,
14
Analysis of Miller Region Sustained Oscillations during Tur..:
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2023 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
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