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2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ,
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Effect of leading edge geometry on the performance of plate..:
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Capillary-activated scalable microporous copper microchanne..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Imaging sub-surface defects in power electronic modules usi..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Single-phase Cooling Performance of a Topology Optimized an..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Thermal Performance Evaluation of a Two-Layer Wick Vapor Ch..:
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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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