Jourdon, J.
216  Ergebnisse:
Personensuche X
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1

Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 H..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Moreau, S. ; Bouchu, D. ; Jourdon, J.... - p. 1-7 , 2023
 
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2

3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling..:

, In: 2022 International Electron Devices Meeting (IEDM),
Guyader, F. ; Batude, P. ; Malinge, P.... - p. 37.4.1-37.4.4 , 2022
 
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Review—Hybrid Bonding-Based Interconnects: A Status on the ..:

Moreau, S. ; Jourdon, J. ; Lhostis, S....
ECS Journal of Solid State Science and Technology.  11 (2022)  2 - p. 024001 , 2022
 
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Impact of Process Variations on the Capacitance and Electri..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Ayoub, B. ; Lhostis, S. ; Moreau, S.... - p. 453-458 , 2020
 
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Thermochronology of the highest central Asian massifs (Khan..:

Rolland, Y. ; Jourdon, A. ; Petit, C....
Journal of Asian Earth Sciences.  200 (2020)  - p. 104466 , 2020
 
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