Jung, Boo Yang
1176  Ergebnisse:
Personensuche X
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1

Development of low profile fan out PoP solution with embedd..:

, In: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC),
 
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3

Flip-chip process using heat transfer from an induction-hea..:

Oh, Tae-Sung ; Lee, Kwang-Yong ; Lee, Yoon-Hee.
Metals and Materials International.  15 (2009)  3 - p. 479-485 , 2009
 
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4

A Study on Interfacial Reaction between Electroless Plated ..:

Choi, J.K. ; Kang, H.B. ; Lee, J.W...
Materials Science Forum.  449-452 (2004)  - p. 405-408 , 2004
 
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5

Evaluation of the Significance of Incidental Breast Lesions..:

Kim, Jae Hyun ; Chang, Yun-Woo ; Hwang, Jung Hwa...
Journal of the Korean Society of Radiology.  68 (2013)  3 - p. 229 , 2013
 
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6

Radiologic Findings of Various Diseases of the Axillary Lym..:

Ryu, Guen Ho ; Chang, Yun-Woo ; Kim, Hyung Hwan...
Journal of the Korean Society of Radiology.  62 (2010)  5 - p. 501 , 2010
 
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7

A Case of Atypical Distribution of Pulmonary Tuberculosis i..:

Hwang, Hun Gyu ; Jung, Eun Jung ; Lim, Gune Il..
Tuberculosis and Respiratory Diseases.  69 (2010)  1 - p. 52 , 2010
 
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8

Usefulness of Modified Intravenous Analgesia: Initial Exper..:

Yang, Seung Boo ; Jung, Young Jin ; Goo, Dong Erk.
Journal of the Korean Radiological Society.  54 (2006)  4 - p. 259 , 2006
 
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9

Giant Presacral Schwannoma: A Case Report:

Lee, Hae Seung ; Kim, Hyun Cheol ; Bae, Won Kyung...
Journal of the Korean Radiological Society.  52 (2005)  4 - p. 251 , 2005
 
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10

Effects of atmospheric pressure plasma surface treatments o..:

Lee, Young-Chul ; Kim, Jong-Woong ; Yoon, Jeong-Won...
Metals and Materials International.  19 (2013)  4 - p. 829-834 , 2013
 
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12

Microstructure of interfacial reaction layer in Sn–Ag–Cu/el..:

Kang, Han-Byul ; Bae, Jee-Hwan ; Yoon, Jeong-Won...
Journal of Materials Science: Materials in Electronics.  22 (2011)  9 - p. 1308-1312 , 2011
 
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15

Initial interfacial reaction layers formed in Sn–3.5Ag sold..:

Kang, Han-Byul ; Lee, Jae-Wook ; Bae, Jee-Hwan...
Journal of Materials Research.  23 (2008)  8 - p. 2195-2201 , 2008
 
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