E-LIB Suche - Ergebnisse für: Jung, Jae Pil

1

Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints fo..:

Rajendran, Sri Harini ; Ku, Jun Ho ; Kang, Jiwan.
Materials Today Communications. 38 (2024) - p. 108250 , 2024

Link: https://doi.org/10.1016/..

2

Taguchi Optimization of Wetting, Thermal and Mechanical Pro..:

Hong, Sung-joon ; Sharma, Ashutosh ; Jung, Jae Pil
Materials. 17 (2024) 11 - p. 2661 , 2024

Link: https://doi.org/10.3390/..

3

Eutectic Bonding in Sequential Bi and Sn Layers for Low-Tem..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Rajendran, Sri Harini ; Jung, Jae Pil ; Jung, Chul Hwa. - p. 277-278 , 2024

Link: https://doi.org/10.23919..

4

Sn-3.0Ag-0.5Cu Solder Enriched with Tb4O7 Nanoparticles for..:

Sharma, Ashutosh ; Hwang, Seung Jun ; Jung, Jae Pil
ACS Applied Nano Materials. 7 (2024) 2 - p. 2110-2119 , 2024

Link: https://doi.org/10.1021/..

5

Sn–Bi–Ag Solder Enriched with Ta2O5 Nanoparticles for Flexi..:

Sharma, Ashutosh ; Kang, HyeJun ; Jung, Jae Pil
ACS Applied Nano Materials. 7 (2024) 2 - p. 1562-1571 , 2024

Link: https://doi.org/10.1021/..

6

Recent Progress of TGV Technology for High Performance Semi..:

Seok, Beom Chang ; Jung, Jae Pil
Journal of Welding and Joining. 42 (2024) 2 - p. 155-164 , 2024

Link: https://doi.org/10.5781/..

7

Joining Si3N4 ceramic to Invar using Mo mesh and Cu foil in..:

Rajendran, Sri Harini ; Lee, Gyeong Ah ; Park, Jin Yong..
Materials Chemistry and Physics. 313 (2024) - p. 128732 , 2024

Link: https://doi.org/10.1016/..

8

Electrochemical deposition of Sn-0.7Cu alloy modified with ..:

Lee, Gyeong Ah ; Sharma, Ashutosh ; Jung, Jae Pil
Journal of Materials Science: Materials in Electronics. 35 (2024) 14 - p. , 2024

Link: https://doi.org/10.1007/..

9

Microstructure and Mechanical Properties of Type 8 Solder P..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Ku, Jun Ho ; Rajendran, Sri Harini ; Jung, Jae Pil - p. 309-310 , 2024

Link: https://doi.org/10.23919..

10

Recent Advances in High Entropy Alloy Fillers for Brazing S..:

Khan, Furkan ; Rajendran, Sri Harini ; Jung, Jae Pil
Metals and Materials International. 30 (2023) 5 - p. 1145-1169 , 2023

Link: https://doi.org/10.1007/..

11

Advanced 3D Through-Si-Via and Solder Bumping Technology: A..:

Jang, Ye Jin ; Sharma, Ashutosh ; Jung, Jae Pil
Materials. 16 (2023) 24 - p. 7652 , 2023

Link: https://doi.org/10.3390/..

12

Effect of 0D and 1D ZnO nano additive reinforced Sn-3.0Ag-0..:

Rajendran, Sri Harini ; Seo, Seong Min ; Jung, Jae Pil
Materials Today Communications. 35 (2023) - p. 105795 , 2023

Link: https://doi.org/10.1016/..

13

A Review of the Brazeability of Low-Temperature and Nano-Re..:

Furkan ; Kim, Hye-Jeong ; Lee, Gun-hwan.
Journal of Welding and Joining. 40 (2022) 3 - p. 216-224 , 2022

Link: https://doi.org/10.5781/..

14

Effect of Surface Pretreatment and Plating Time on Electrom..:

Jung, Jae Pil ; Lee, Jung-Hyun ; Sharma, Ashutosh
ACS Applied Electronic Materials. 4 (2022) 3 - p. 1019-1028 , 2022

Link: https://doi.org/10.1021/..

15

Investigating the physical, mechanical, and reliability stu..:

Rajendran, Sri Harini ; Jung, Do Hyun ; Jung, Jae Pil
Journal of Materials Science: Materials in Electronics. 33 (2022) 7 - p. 3687-3710 , 2022

Link: https://doi.org/10.1007/..