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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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A Time and Cost-Efficient Design Methodology to Estimate Ef..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Assessment of Thermal-aware Floorplans in a 3D IC for Serve..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Mechanical Design and Reliability of Gold-Tin Eutectic Bond..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
7
Considerations and Challenges for Large Area Embedded Micro..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
8
Microfabrication Challenges for Silicon-based Large Area (>..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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