Personensuche
X
?
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
2
Full-Field Through-Chip IR-Thermography-based Quality Testi..:
, In:
?
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
4
Investigation of Aluminum and Gold Flip-Chip Bonding for Qu..:
, In:
?
5
Archiv für Tierernährung
[Akad.-Verl., 1950-1985] ; Band 3, Heft 3: November-Dezembe...
Archiv für Tierernährung ; Band 3, Heft 3
?
6
Physica status solidi / A
Volume 110, Number 2, December 16
Physica status solidi / A ; Volume 110, Number 2
?
7
Physica status solidi
Volume 110, Number 2: December 16
Physica status solidi ; Volume 110, Number 2, A
?
11
Certification of 244Pu spikereference material: IRMM-042a :..
EUR, Scientific and technical research series, 28943