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2021 22nd International Conference on Electronic Packaging Technology (ICEPT) ,
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Destructive Physical Analysis Methods of Flip Chip Packagin..:
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2014 IEEE MTT-S International Microwave Symposium (IMS2014) ,
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An integrated 60GHz low power two-chip wireless system base..:
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IEEE MTT-S International Microwave Symposium Digest, 2005. ,
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Experimentally investigating slow-wave transmission lines a..:
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Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. ,
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