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Kalas, David
288  Ergebnisse:
Personensuche X
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1

Towards Additively Manufactured Alumina Substrates for Prin..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
Janda, Martin ; Kalas, David ; Sima, Karel. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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2

Interconnection of Highly Flexible Carbon Threads Suitable ..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
Radouchova, Michaela ; Janda, Martin ; Kalas, David. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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3

Novel SMD Component and Module Interconnection and Encapsul..:

Kalaš, David ; Soukup, Radek ; Řeboun, Jan...
Polymers.  15 (2023)  11 - p. 2526 , 2023
Link: https://doi.org/10.3390/..
 
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4

Real-Life Functional Tests of Conductive Joints of SMD Comp..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Hirman, Martin ; Hamernik, Karel ; Kalas, David... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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5

Characterisation of Polyurethane Potting Compounds with Sem..:

, In: 2022 9th International Conference on Condition Monitoring and Diagnosis (CMD),
Kalas, David ; Kadlec, Petr ; Pretl, Silvan.. - p. 471-474 , 2022
Link: https://doi.org/10.23919..
 
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6

Usability Study of Conductive Filament Used for Rapid Proto..:

, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE),
Sima, Karel ; Kalas, David ; Soukup, Radek.. - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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7

Interconnecting embroidered hybrid conductive yarns by ultr..:

Dils, Christian ; Kalas, David ; Reboun, Jan...
Textile Research Journal.  , 2022
Link: https://doi.org/10.1177/..
 
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8

FFF 3D Printing in Electronic Applications: Dielectric and ..:

Kalaš, David ; Šíma, Karel ; Kadlec, Petr...
Polymers.  13 (2021)  21 - p. 3702 , 2021
Link: https://doi.org/10.3390/..
 
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9

Washing Resistance of Textile Ribbon Dismountable Interconn..:

, In: 2021 44th International Spring Seminar on Electronics Technology (ISSE),
Sima, Karel ; Reboun, Jan ; Moravcova, Daniela... - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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10

Interconnection of Terminals on Flexible Substrates it Prin..:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Reboun, Jan ; Kalas, David ; Michal, David. - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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11

A Contact Structure for the Hybrid Resistive Embroidery Thr..:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Kalcik, Jan ; Kalas, David ; Suchy, Stanislav. - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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12

A Comparison of Resistance Spot and Ultrasonic Welding of H..:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Suchy, Stanislav ; Kalas, David ; Kalcik, Jan. - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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13

Resistance Measurement Method for IoT and Low Power Applica..:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Sima, Karel ; Kalas, David ; Pretl, Silvan. - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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14

Contacting of SMD Components on the Textile Substrates:

, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE),
Kalas, David ; Suchy, Stanislav ; Kalcik, Jan... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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15

Novel SMD Component and Module Interconnection and Encapsul..:

Kalaš, David ; Soukup, Radek ; Řeboun, Jan...
Polymers.  , 2023
Link: http://hdl.handle.net/11..
 
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