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1

Glass and Glass/LTCC Interposers as Heterogenous Integratio..:

, In: 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific),

Muller, Jens ; Kaltwasser, Mahsa ; Bartsch, Heike... - p. 1-7 , 2024

Link: https://doi.org/10.23919..

2

Low insertion loss interposer approach for RF applications ..:

Bartsch, Heike ; Kaltwasser, Mahsa ; Karimi, Kiana.
Materials Research Bulletin. 178 (2024) - p. 112902 , 2024

Link: https://doi.org/10.1016/..

3

Glass-LTCC-Interposer, a New Plattform for HF-Applications:

, In: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),

Kaltwasser, Mahsa ; Schulz, Alexander ; Muller, Jens - p. 1-5 , 2023

Link: https://doi.org/10.23919..

4

Fluidic Self-Assembly on Electroplated Multilayer Solder Bu..:

Kaltwasser, Mahsa ; Schmidt, Udo ; Lösing, Lars...
Scientific Reports. 9 (2019) 1 - p. , 2019

Link: https://doi.org/10.1038/..

5

Localized collection of airborne biological hazards for env..:

Reiprich, Johannes ; Gebinoga, Michael ; Traue, Lutz-Philipp...
Sensors and Actuators B: Chemical. 273 (2018) - p. 906-915 , 2018

Link: https://doi.org/10.1016/..

6

Core–Shell Transformation-Imprinted Solder Bumps Enabling L..:

Kaltwasser, Mahsa ; Schmidt, Udo ; Biswas, Shantonu...
ACS Applied Materials & Interfaces. 10 (2018) 47 - p. 40608-40613 , 2018

Link: https://doi.org/10.1021/..

7

3D metamorphic stretchable microphone arrays:

Biswas, Shantonu ; Reiprich, Johannes ; Cohrs, Thaden...
Advanced materials technologies -- 10.1002/(ISSN)2365-709X -- 2365-709X -- 946262010 -- 947071768 -- 953841190 -- https://onlinelibrary.wiley.com/journal/2365709X -- http://www.bibliothek.uni-regensburg.de/ezeit/?2850995 -- http://uri.gbv.de/document/gvk:ppn:855611952. , 2017

Link: https://doi.org/10.1002/..

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