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X
Kang, Andrew
3387  Ergebnisse:
Personensuche X
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1

Fan-Out Embedded Bridge Structure for CoPackaged Optics Cha..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Vito ; Shih, Teny ; Kang, Andrew. - p. 1246-1250 , 2024
Link: https://doi.org/10.1109/..
 
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2

High Speed Signal Design on Fan-Out RDL Interposer for Arti..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Zhuang, Ming-Han ; Shih, Chih-Yuan ; Lin, Ho-Chuan.. - p. 275-276 , 2024
Link: https://doi.org/10.23919..
 
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3

FOPOP Warpage Analysis for Package Design Optimization:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Zhang, Ken ; Lin, Vito ; Shih, Teny.. - p. 77-78 , 2023
Link: https://doi.org/10.23919..
 
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4

High Power Advanced Package with Water Cooling System Evalu..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Lin, Shane ; Lin, Dan ; Lin, Vito... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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5

High Speed SerDes Design on Flip Chip Package Substrate:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhuang, Ming-Han ; Lai, Chia-Chu ; Lin, Ho-Chuan... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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6

Package Design Optimization of Thin Mold Double Side System..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Yen, Freedman ; Lin, Vito ; Shih, Teny.. - p. 738-741 , 2023
Link: https://doi.org/10.1109/..
 
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7

Fan-Out Embedded Bridge with TSV(FO-EB-T) Package Character..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lin, Vito ; Shih, Teny ; Kang, Andrew. - p. 1344-1347 , 2023
Link: https://doi.org/10.1109/..
 
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8

Package Warpage of Whole Strip Evaluation with Interface An..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Ho, Ian ; Liao, Po-Yu ; Shih, Teny.. - p. 923-928 , 2023
Link: https://doi.org/10.1109/..
 
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9

Antenna-in-Package Electrical Research for Beyond 5G applic..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lai, Chia-Chu ; Lin, Sam ; Shih, Teny.. - p. 63-66 , 2023
Link: https://doi.org/10.1109/..
 
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10

Fan-Out Embedded Bridge Solution for Chiplet/HBM Integratio:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liao, Mark ; Lin, Vito ; Kang, Andrew... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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11

Study of Parameter Tuning for the Curing Condition on ABF T..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ye, Rick ; Chen, Eric ; Teng, Wen-Yu.. - p. 1987-1990 , 2022
Link: https://doi.org/10.1109/..
 
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12

Study of Measurement Index on the Polymer-to-Metal Direct-a..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Pai, Yu-Cheng ; Yeh, Chan-Yu ; Teng, Wen-Yu.. - p. 227-228 , 2022
Link: https://doi.org/10.23919..
 
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13

Initial oil concentration affects hydrocarbon biodegradatio..:

Bacosa, Hernando P. ; Kang, Andrew ; Lu, Kaijun.
Marine Pollution Bulletin.  162 (2021)  - p. 111867 , 2021
Link: https://doi.org/10.1016/..
 
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14

Ashurbanipal: A Diristry to Document Multimedia Metadata To..:

, In: 2021 International Conference on Computational Science and Computational Intelligence (CSCI),
Athreya, Anousha ; Taswell, S. Koby ; Kang, Andrew.. - p. 540-543 , 2021
Link: https://doi.org/10.1109/..
 
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15

Understanding and Regulating Twenty-First Century Payment S..:

Rosner, Marcel T. ; Kang, Andrew
Michigan Law Review.  114 (2016)  4 - p. 649-681 , 2016
Link: http://www.jstor.org/sta..
 
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