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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Fan-Out Embedded Bridge Structure for CoPackaged Optics Cha..:
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2024 International Conference on Electronics Packaging (ICEP) ,
2
High Speed Signal Design on Fan-Out RDL Interposer for Arti..:
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2023 International Conference on Electronics Packaging (ICEP) ,
3
FOPOP Warpage Analysis for Package Design Optimization:
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
4
High Power Advanced Package with Water Cooling System Evalu..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
5
High Speed SerDes Design on Flip Chip Package Substrate:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
6
Package Design Optimization of Thin Mold Double Side System..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
7
Fan-Out Embedded Bridge with TSV(FO-EB-T) Package Character..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
8
Package Warpage of Whole Strip Evaluation with Interface An..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
9
Antenna-in-Package Electrical Research for Beyond 5G applic..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
10
Fan-Out Embedded Bridge Solution for Chiplet/HBM Integratio:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
11
Study of Parameter Tuning for the Curing Condition on ABF T..:
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2022 International Conference on Electronics Packaging (ICEP) ,
12
Study of Measurement Index on the Polymer-to-Metal Direct-a..:
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2021 International Conference on Computational Science and Computational Intelligence (CSCI) ,
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