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Kangasvieri, T
15  Ergebnisse:
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1

Enhanced thermal fatigue endurance and lifetime prediction ..:

Nousiainen, O. ; Salmela, O. ; Putaala, J..
Soldering & Surface Mount Technology.  23 (2011)  2 - p. 104-114 , 2011
Link: https://doi.org/10.1108/..
 
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2

Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2...:

Nousiainen, O. ; Kangasvieri, T. ; Rautioaho, R..
Soldering & Surface Mount Technology.  23 (2011)  1 - p. 30-39 , 2011
Link: https://doi.org/10.1108/..
 
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3

Effect of ENIG deposition on the failure mechanisms of ther..:

Nousiainen, O. ; Kangasvieri, T. ; Kautio, K...
Soldering & Surface Mount Technology.  22 (2010)  3 - p. 22-35 , 2010
Link: https://doi.org/10.1108/..
 
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4

Low‐loss and broadband BGA package transition for LTCC‐SiP ..:

Kangasvieri, T. ; Halme, J. ; Vähäkangas, J..
Microwave and Optical Technology Letters.  50 (2008)  4 - p. 1036-1040 , 2008
Link: https://doi.org/10.1002/..
 
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5

Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free com..:

Nousiainen, O. ; Kangasvieri, T. ; Rautioaho, R..
Soldering & Surface Mount Technology.  20 (2008)  3 - p. 11-17 , 2008
Link: https://doi.org/10.1108/..
 
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6

Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu sph..:

Nousiainen, O. ; Lehtiniemi, L. ; Kangasvieri, T...
Microelectronics Reliability.  48 (2008)  4 - p. 622-630 , 2008
Link: https://doi.org/10.1016/..
 
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7

Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plas..:

NOUSIAINEN, O. ; PUTAALA, J. ; KANGASVIERI, T...
Journal of Electronic Materials.  36 (2007)  3 - p. 232-241 , 2007
Link: https://doi.org/10.1007/..
 
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8

Reliability and RF performance of BGA solder joints with pl..:

Kangasvieri, T. ; Nousiainen, O. ; Putaala, J...
Microelectronics Reliability.  46 (2006)  8 - p. 1335-1347 , 2006
Link: https://doi.org/10.1016/..
 
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9

Metallurgical reactions in composite 90Pb10Sn/lead-free sol..:

Nousiainen, O. ; Putaala, J. ; Kangasvieri, T...
Journal of Electronic Materials.  35 (2006)  10 - p. 1857-1865 , 2006
Link: https://doi.org/10.1007/..
 
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10

Miniaturized low‐loss Wilkinson power divider for RF front‐..:

Kangasvieri, T. ; Hautajärvi, I. ; Jantunen, H..
Microwave and Optical Technology Letters.  48 (2006)  4 - p. 660-663 , 2006
Link: https://doi.org/10.1002/..
 
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11

Design aspects of microwave components with LTCC technique:

Jantunen, H. ; Kangasvieri, T. ; Vähäkangas, J..
Journal of the European Ceramic Society.  23 (2003)  14 - p. 2541-2548 , 2003
Link: https://doi.org/10.1016/..
 
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12

Kieli-, kulttuuri- ja katsomustietoisuus koulutuksen ja kas..:

Alisaari, J ; Bergroth, Mari ; Kangasvieri, T..
Alisaari , J , Bergroth , M , Kangasvieri , T , Moate , J & Viinikainen , T 2020 , ' Kieli-, kulttuuri- ja katsomustietoisuus koulutuksen ja kasvatuksen kentällä. ' , Kieli, Koulutus Ja Yhteiskunta , vol. 11 , no. 3 , pp. – ..  , 2020
Link: https://research.abo.fi/..
 
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13

Effect of voids on thermomechanical cracking in lead-free S..:

Hagberg, J. (Juha) ; Nousiainen, O. (Olli) ; Putaala, J. (Jussi)... , 2020
Link: http://urn.fi/urn:nbn:fi..
 
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14

Power module interconnection reliability in BTS application:

Putaala, J. (Jussi) ; Hagberg, J. (Juha) ; Kangasvieri, T. (Tero)... , 2019
Link: http://urn.fi/urn:nbn:fi..
 
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15

Surface-mountable LTCC-SiP module approach for reliable RF ..:

Kangasvieri, T. (Tero)
info:eu-repo/semantics/altIdentifier/pissn/0355-3213.  , 2008
Link: http://urn.fi/urn:isbn:9..
 
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