Kannan, Sukeshwar
11  Ergebnisse:
Personensuche X
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1

High Density Integration of Silicon Photonic Chiplets for 5..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kannan, Sukeshwar ; Chang, Ray ; Potluri, Hari... - p. 81-84 , 2024
 
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2

High Density Integration Technologies for SiPh Based Optica..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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3

Built-in Self-Test and Fault Localization for Inter-Layer V..:

Chaudhuri, Arjun ; Banerjee, Sanmitra ; Kim, Jinwoo...
ACM Journal on Emerging Technologies in Computing Systems.  18 (2021)  1 - p. 1-37 , 2021
 
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4

Compact Scalable Dynamic TSV IR Drop Compensation for Power..:

, In: 2019 IEEE 62nd International Midwest Symposium on Circuits and Systems (MWSCAS),
Chaudhuri, Arjun ; Kannan, Sukeshwar ; England, Luke. - p. 1179-1182 , 2019
 
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5

Impact of Electrostatic Coupling and Wafer-Bonding Defects ..:

Koneru, Abhishek ; Kannan, Sukeshwar ; Chakrabarty, Krishnendu
ACM Journal on Emerging Technologies in Computing Systems (JETC).  13 (2017)  4 - p. 1-23 , 2017
 
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6

Impact of Electrostatic Coupling and Wafer-Bonding Defects ..:

Koneru, Abhishek ; Kannan, Sukeshwar ; Chakrabarty, Krishnendu
ACM Journal on Emerging Technologies in Computing Systems.  13 (2017)  4 - p. 1-23 , 2017
 
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7

Power delivery in 3D packages : current crowding effects..:

, In: Proceedings of the 35th International Conference on Computer-Aided Design,
 
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8

Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip f..:

Gao, Shan ; Smith, Ryan Scott ; Cho, Jae Kyu...
ECS Journal of Solid State Science and Technology.  4 (2014)  1 - p. N3134-N3139 , 2014
 
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