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Karim, Zia
129  Ergebnisse:
Personensuche X
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1

High Aspect Ratio (AR) Through Glass Via (TGV) Etch Perform..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kim, Sung Jin ; Govindarajulu, Venugopal ; Tao, Coby.. - p. 551-555 , 2024
Link: https://doi.org/10.1109/..
 
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2

Various Defect Mechanism Analysis for Optimization of Vacuu..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Jing, Lei ; Lin, Alvin ; Tan, Xinxuan... - p. 1-7 , 2024
Link: https://doi.org/10.1109/..
 
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3

Impact of Process Parameters on Vacuum Fluxless Solder Refl..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Jing, Lei ; Kudriavtsev, Vladimir ; Nguyen, Taylor... - p. 1541-1548 , 2023
Link: https://doi.org/10.1109/..
 
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4

Impact of Thermal Annealing and Other Process Parameters on..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Ajayi, Taiwo ; Gatimu, Alvin ; Brun, Xavier F.... - p. 1426-1432 , 2023
Link: https://doi.org/10.1109/..
 
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5

(Invited) Improvements in Thermal Budget and Film Propertie..:

Song, Kay ; Karim, Zia ; Tan, Xinxuan...
ECS Transactions.  111 (2023)  1 - p. 31-39 , 2023
Link: https://doi.org/10.1149/..
 
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6

Reducing the Thermal Budget in Low-Temperature Polyimide Di..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Karim, Zia ; Song, Kay ; Sandstrom, Cliff... - p. 551-554 , 2022
Link: https://doi.org/10.1109/..
 
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7

Better Thermal, Mechanical and Dielectric Properties of Cur..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Karim, Zia ; Sautter, Kenneth ; Song, Kay... - p. 321-326 , 2020
Link: https://doi.org/10.1109/..
 
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8

Preface—Focus Issue on 2D Layered Materials: From Fundament..:

Jaegermann, Wolfram ; Karim, Zia ; Obeng, Yaw.
ECS Journal of Solid State Science and Technology.  9 (2020)  9 - p. 090001 , 2020
Link: https://doi.org/10.1149/..
 
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9

Preface—Focus Issue on 2D Layered Materials: From Fundament..:

Jaegermann, Wolfram ; Karim, Zia ; Obeng, Yaw.
Journal of The Electrochemical Society.  167 (2020)  14 - p. 140001 , 2020
Link: https://doi.org/10.1149/..
 
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10

Antiferroelectricity in lanthanum doped zirconia without me..:

Wang, Zheng ; Gaskell, Anthony Arthur ; Dopita, Milan...
Applied Physics Letters.  112 (2018)  22 - p. , 2018
Link: https://doi.org/10.1063/..
 
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11

Growth and characterization of an In0.53Ga0.47As-based Meta..:

Orzali, Tommaso ; Vert, Alexey ; Kim, Tae-Woo...
Journal of Crystal Growth.  427 (2015)  - p. 72-79 , 2015
Link: https://doi.org/10.1016/..
 
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12

GaAs on Si epitaxy by aspect ratio trapping: Analysis and r..:

Orzali, Tommaso ; Vert, Alexey ; O'Brien, Brendan...
Journal of Applied Physics.  118 (2015)  10 - p. , 2015
Link: https://doi.org/10.1063/..
 
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13

(Invited) Technology Options to Reduce Contact Resistance i..:

Lee, Rinus T.P. ; Loh, Wei Yip ; Tieckelmann, Robert...
ECS Transactions.  66 (2015)  4 - p. 125-134 , 2015
Link: https://doi.org/10.1149/..
 
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14

Role of moesin in hyaluronan induced cell migration in glio..:

DeSouza, Leroi V ; Matta, Ajay ; Karim, Zia...
Molecular Cancer.  12 (2013)  1 - p. , 2013
Link: https://doi.org/10.1186/..
 
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15

Highly Conformal ALD of ZrO2 at Higher Process Temperatures..:

Senzaki, Yoshi ; Okuyama, Yoshi ; Kim, Gi...
ECS Transactions.  25 (2009)  4 - p. 201-207 , 2009
Link: https://doi.org/10.1149/..
 
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