Personensuche
X
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
A Microstructural Investigation of Sub-1 μm Copper Bonding ..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
Voids-free Die-level Cu/ILD Hybrid bonding:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
4
Thermal Characterization of 3-D Stacked Heterogeneous Integ..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
6
A Methodology to Optimize Laser Dicing Parameters to Maximi..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
8
Volume-controllable Solder Bumping Technology to Package Su..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
9
Modeling of the Temperature Profile and Residual Stress Dur..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
10
Heterogeneous Integration on Organic Interposer Substrate w..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
11
Artificial Intelligence (AI) based methodology to minimize ..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
12
Next Generation Infrared (IR) Laser Debonding / Silicon Han..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
13
Functional Testing of AI Cores through Thinned 3D I/O Buffe..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
14
Thermo-mechanical Analysis of Thermal Compression Bonding C..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
15