E-LIB Suche - Ergebnisse für: Keller, J.R.

1

Detection of atomic force microscopy cantilever displacemen..:

Wagner, R. ; Woehl, T. J. ; Keller, R. R..
Applied Physics Letters. 109 (2016) 4 - p. , 2016

Link: https://doi.org/10.1063/..

2

Specimen‐thickness effects on transmission Kikuchi patterns..:

RICE, K.P. ; KELLER, R.R. ; STOYKOVICH, M.P.
Journal of Microscopy. 254 (2014) 3 - p. 129-136 , 2014

Link: https://doi.org/10.1111/..

3

New Measurements on the Minimum and Maximum Sample Sizes in..:

Geiss, R.H. ; Rice, K.P. ; Keller, R.R.
Microscopy and Microanalysis. 19 (2013) S2 - p. 696-697 , 2013

Link: https://doi.org/10.1017/..

4

Transmission EBSD from 10 nm domains in a scanning electron..:

KELLER, R.R. ; GEISS, R.H.
Journal of Microscopy. 245 (2011) 3 - p. 245-251 , 2011

Link: https://doi.org/10.1111/..

5

Strain-Induced Grain Growth during Rapid Thermal Cycling of..:

Keller, R.R. ; Geiss, R.H. ; Barbosa III, N...
Metallurgical and Materials Transactions A. 38 (2007) 13 - p. 2263-2272 , 2007

Link: https://doi.org/10.1007/..

6

Comparison of Electrical and Microtensile Evaluations of Me..:

Barbosa III, N. ; Keller, R.R. ; Read, D.T...
Metallurgical and Materials Transactions A. 38 (2007) 13 - p. 2160-2167 , 2007

Link: https://doi.org/10.1007/..

7

TEM Study of Dislocation Loops in Deformed Aluminum Films:

Geiss, R H ; Read, D T ; Keller, R R
Microscopy and Microanalysis. 11 (2005) S02 - p. , 2005

Link: https://doi.org/10.1017/..

8

Applications of EBSD to the Study of Localized Deformation:

Geiss, R H ; Read, D T ; Roshko, A..
Microscopy and Microanalysis. 11 (2005) S02 - p. , 2005

Link: https://doi.org/10.1017/..

9

Thermal fatigue testing of thin metal films:

Mönig, R. ; Keller, R. R. ; Volkert, C. A.
Review of Scientific Instruments. 75 (2004) 11 - p. 4997-5004 , 2004

Link: https://doi.org/10.1063/..

10

Electrical properties of superfilled sub-micrometer silver ..:

Josell, D. ; Burkhard, C. ; Li, Y....
Journal of Applied Physics. 96 (2004) 1 - p. 759-768 , 2004

Link: https://doi.org/10.1063/..

11

EBSD measurement of strains in GaAs due to oxidation of bur..:

Keller, R.R ; Roshko, A ; Geiss, R.H..
Microelectronic Engineering. 75 (2004) 1 - p. 96-102 , 2004

Link: https://doi.org/10.1016/..

12

Influence of Triple Junction Structure on Cu Segregation in..:

Wauchope, C.J. ; Keller, R.R. ; Sanchez Jr., J.E.
Microscopy and Microanalysis. 5 (1999) S2 - p. 846-847 , 1999

Link: https://doi.org/10.1017/..

13

Local crystallography and stress voiding in Al–Si–Cu versus..:

Keller, R. R. ; Kalnas, C. E. ; Phelps, J. M.
Journal of Applied Physics. 86 (1999) 2 - p. 1167-1169 , 1999

Link: https://doi.org/10.1063/..

14

Grain boundary misorientation angles and stress-induced voi..:

Nucci, J. A. ; Keller, R. R. ; Field, D. P..
Applied Physics Letters. 70 (1997) 10 - p. 1242-1244 , 1997

Link: https://doi.org/10.1063/..

15

Local textures and grain boundaries in voided copper interc..:

Keller, R. R. ; Nucci, J. A. ; Field, D. P.
Journal of Electronic Materials. 26 (1997) 9 - p. 996-1001 , 1997

Link: https://doi.org/10.1007/..