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Kim, Daewoo
339  Ergebnisse:
Personensuche X
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1

A study on D2W Hybrid Cu bonding Technology for HBM Multi-d..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Hyeonmin ; Kim, Jihoon ; Kim, Min-Ki... - p. 76-80 , 2024
Link: https://doi.org/10.1109/..
 
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2

High Performance 3D Package Technology for Mobile Applicati..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kim, Sun Jae ; Kim, Cheol ; Jang, Huiyeong... - p. 348-352 , 2024
Link: https://doi.org/10.1109/..
 
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3

Management of chronic rhinosinusitis with nasal polyps in t..:

Karpischenko, Sergey ; Jung, Yong Gi ; Kim, Dae-Woo...
Asia Pacific Allergy.  14 (2024)  2 - p. 77-83 , 2024
Link: https://doi.org/10.5415/..
 
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4

Are Your Epochs Too Epic? Batch Free Can Be Harmful:

, In: Proceedings of the 29th ACM SIGPLAN Annual Symposium on Principles and Practice of Parallel Programming,
Kim, Daewoo ; Brown, Trevor ; Singh, Ajay - p. 30-41 , 2024
Link: https://dl.acm.org/doi/1..
 
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5

MTM: Rethinking Memory Profiling and Migration for Multi-Ti..:

, In: Proceedings of the Nineteenth European Conference on Computer Systems,
Ren, Jie ; Xu, Dong ; Ryu, Junhee... - p. 803-817 , 2024
Link: https://dl.acm.org/doi/1..
 
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6

Exothermic Characteristics Evaluation of the Pt coated α-Al..:

Lee, Hyun Chul ; Bang, Jungjin ; Jang, Kiwan...
Nuclear Engineering and Technology.  , 2024
Link: https://doi.org/10.1016/..
 
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7

0950 Sound-based Sleep Staging at Home Using Smartphone via..:

Tran, Hai ; Hong, Jung Kyung ; Jang, Hyeryung...
SLEEP.  46 (2023)  Supplement_1 - p. A418-A419 , 2023
Link: https://doi.org/10.1093/..
 
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8

All polymeric conductive strain sensors with excellent skin..:

Lee, Goeun ; Seo, Hyunsu ; Kim, Daewoo..
RSC Advances.  13 (2023)  3 - p. 1672-1683 , 2023
Link: https://doi.org/10.1039/..
 
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9

Accuracy of 11 Wearable, Nearable, and Airable Consumer Sle..:

Lee, Taeyoung ; Cho, Younghoon ; Cha, Kwang Su...
JMIR mHealth and uHealth.  11 (2023)  - p. e50983 , 2023
Link: https://doi.org/10.2196/..
 
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10

0949 Real-time acoustic apnea event detector by training a ..:

Le, Linh ; Kim, Daewoo ; Cho, Eunsung...
SLEEP.  46 (2023)  Supplement_1 - p. A418-A418 , 2023
Link: https://doi.org/10.1093/..
 
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11

Extremely Large 3.5D Heterogeneous Integration for the Next..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lee, Ilbok ; Nam, Soohyun ; Kim, Sungeun... - p. 893-898 , 2023
Link: https://doi.org/10.1109/..
 
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12

Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applica..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kim, Yeongseon ; Kim, Juhyeon ; Kim, Hyoeun... - p. 1043-1047 , 2023
Link: https://doi.org/10.1109/..
 
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13

Adsorptive recovery of rare earth elements from aqueous sol..:

Kim, Hee Seo ; Kim, Dae-Woo ; Park, In-Su.
Journal of Cleaner Production.  418 (2023)  - p. 138189 , 2023
Link: https://doi.org/10.1016/..
 
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14

Reset-First and Multibit-Level Resistive-Switching Behavior..:

Kim, Daewoo ; Lee, Jeongwoo ; Kim, Jaeyeon.
Materials.  16 (2023)  14 - p. 4992 , 2023
Link: https://doi.org/10.3390/..
 
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15

A Study on Memory Stack Process by Hybrid Copper Bonding (H..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lee, Sanghoon ; Jee, Youngkun ; Park, Sangcheon... - p. 1085-1089 , 2022
Link: https://doi.org/10.1109/..
 
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