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Kim, Hoe Chul
2684  Ergebnisse:
Personensuche X
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1

Electrodeposition of Cu-Ag films in ammonia-based electroly..:

Jeon, Youngkeun ; Choe, Seunghoe ; Kim, Hoe Chul..
Journal of Alloys and Compounds.  775 (2019)  - p. 639-646 , 2019
Link: https://doi.org/10.1016/..
 
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2

Thermodynamic aspects of bis(3‑sulfopropyl) disulfide and 3..:

Shen, Huizi ; Kim, Hoe Chul ; Sung, Minjae..
Journal of Electroanalytical Chemistry.  816 (2018)  - p. 132-137 , 2018
Link: https://doi.org/10.1016/..
 
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3

Communication—Acceleration of TSV Filling by Adding Thioure..:

Kim, Hoe Chul ; Kim, Myung Jun ; Kim, Jae Jeong
Journal of The Electrochemical Society.  165 (2018)  3 - p. D91-D93 , 2018
Link: https://doi.org/10.1149/..
 
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4

Effects of Organic Additives on Grain Growth in Electrodepo..:

Sung, Minjae ; Kim, Hoe Chul ; Lim, Taeho.
Journal of The Electrochemical Society.  164 (2017)  13 - p. D805-D809 , 2017
Link: https://doi.org/10.1149/..
 
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5

Voltammetric Observation of Transient Catalytic Behavior of..:

Cho, Sung Ki ; Kim, Hoe Chul ; Kim, Myung Jun.
Journal of The Electrochemical Society.  163 (2016)  8 - p. D428-D433 , 2016
Link: https://doi.org/10.1149/..
 
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6

Communication—Halide Ions in TEG-Based Levelers Affecting T..:

Kim, Myung Jun ; Seo, Youngran ; Oh, Jung Hwan...
Journal of The Electrochemical Society.  163 (2016)  5 - p. D185-D187 , 2016
Link: https://doi.org/10.1149/..
 
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7

The Influences of Iodide Ion on Cu Electrodeposition and TS..:

Kim, Myung Jun ; Kim, Hoe Chul ; Kim, Jae Jeong
Journal of The Electrochemical Society.  163 (2016)  8 - p. D434-D441 , 2016
Link: https://doi.org/10.1149/..
 
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8

High Accuracy Concentration Analysis of Accelerator Compone..:

Choe, Seunghoe ; Kim, Myung Jun ; Kim, Kwang Hwan...
Journal of The Electrochemical Society.  163 (2015)  2 - p. D33-D39 , 2015
Link: https://doi.org/10.1149/..
 
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9

Galvanostatic bottom-up filling of TSV-like trenches: Choli..:

Kim, Myung Jun ; Seo, Youngran ; Kim, Hoe Chul...
Electrochimica Acta.  163 (2015)  - p. 174-181 , 2015
Link: https://doi.org/10.1016/..
 
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10

Electrochemical Behavior of Citric Acid and Its Influence o..:

Kim, Myung Jun ; Choe, Seunghoe ; Kim, Hoe Chul...
Journal of The Electrochemical Society.  162 (2015)  8 - p. D354-D359 , 2015
Link: https://doi.org/10.1149/..
 
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11

Accuracy Improvement in Cyclic Voltammetry Stripping Analys..:

Choe, Seunghoe ; Kim, Myung Jun ; Kim, Kwang Hwan...
Journal of The Electrochemical Society.  162 (2015)  4 - p. H294-H300 , 2015
Link: https://doi.org/10.1149/..
 
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12

Electrodeposition of Cu Films with Low Resistivity and Impr..:

Kim, Hoe Chul ; Kim, Myung Jun ; Choe, Seunghoe...
Journal of The Electrochemical Society.  161 (2014)  14 - p. D749-D755 , 2014
Link: https://doi.org/10.1149/..
 
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13

Effects of nitrogen atoms of benzotriazole and its derivati..:

Kim, Hoe Chul ; Kim, Myung Jun ; Lim, Taeho...
Thin Solid Films.  550 (2014)  - p. 421-427 , 2014
Link: https://doi.org/10.1016/..
 
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14

Bottom-up Filling of through Silicon Vias Using Galvanostat..:

Kim, Hoe Chul ; Choe, Seunghoe ; Cho, Ji Yoon...
Journal of The Electrochemical Society.  162 (2014)  3 - p. D109-D114 , 2014
Link: https://doi.org/10.1149/..
 
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15

Cu direct electrodeposition using step current for superfil..:

Kim, Myung Jun ; Choe, Seunghoe ; Kim, Hoe Chul...
Electrochimica Acta.  147 (2014)  - p. 371-379 , 2014
Link: https://doi.org/10.1016/..
 
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