E-LIB Suche - Ergebnisse für: Kim, Hyunwoong

1

No influence of regular rhythmic priming on grammaticality ..:

Kim, Hyun-Woong ; McLaren, Katie E. ; Lee, Yune Sang
Journal of Experimental Child Psychology. 237 (2024) - p. 105760 , 2024

Link: https://doi.org/10.1016/..

2

Design and Analysis of LCC-S Wireless Power Transfer System..:

Woo, Seongho ; Shin, Yujun ; Lee, Changmin...
IEEE Transactions on Electromagnetic Compatibility. , 2024

Link: https://doi.org/10.1109/..

3

Methodology for Extracting Low-Frequency Input Impedance of..:

Rhee, Jaewon ; Kim, Hyunwoong ; Chu, Kwanguk.
IEEE Transactions on Electromagnetic Compatibility. 66 (2024) 2 - p. 584-598 , 2024

Link: https://doi.org/10.1109/..

4

Rhythmic motor behavior explains individual differences in ..:

Kim, Hyun-Woong ; Kovar, Jessica ; Bajwa, Jesper Singh...
Scientific Reports. 14 (2024) 1 - p. , 2024

Link: https://doi.org/10.1038/..

5

A Method for Deembedding the Mounting Pad and Via-Hole Effe..:

Lee, Sanguk ; Kim, Hyunwoong ; Ahn, Jangyong...
IEEE Transactions on Instrumentation and Measurement. 73 (2024) - p. 1-13 , 2024

Link: https://doi.org/10.1109/..

6

Prior conscious experience modulates the impact of audiovis..:

Kim, Hyun-Woong ; Park, Minsun ; Lee, Yune Sang.
Consciousness and Cognition. 122 (2024) - p. 103709 , 2024

Link: https://doi.org/10.1016/..

7

Beta and gamma binaural beats enhance auditory sentence com..:

Kim, Hyun-Woong ; Happe, Jenna ; Lee, Yune Sang
Psychological Research. 87 (2023) 7 - p. 2218-2227 , 2023

Link: https://doi.org/10.1007/..

8

Signal Integrity Analysis of Through-Silicon-Via (TSV) With..:

Kim, Hyunwoong ; Park, Jongcheol ; Lee, Sanguk..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 12 - p. 1973-1988 , 2023

Link: https://doi.org/10.1109/..

9

Power Integrity Design of Mobile 3D-IC Based on the Allocat..:

, In: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),

Kim, Hyunwoong ; Lee, Seonghi ; Park, Dongryul... - p. 1-3 , 2023

Link: https://doi.org/10.1109/..

10

Signal Integrity Analysis of Wire Bonding Finger Capacitanc..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),

Kim, Hyunwoong ; Park, Gagyeong ; Ryu, Seunghun... - p. 141-146 , 2023

Link: https://doi.org/10.1109/..

11

Design and Analysis of Double-side Characteristic Impedance..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),

Lee, Seonghi ; Kim, Hyunwoong ; Park, Jiyoung... - p. 147-152 , 2023

Link: https://doi.org/10.1109/..

12

Signal Integrity Analysis of Notch-Routing to Reduce Near-E..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),

Ryu, Seunghun ; Kim, Hyunwoong ; Lee, Seonghi... - p. 131-136 , 2023

Link: https://doi.org/10.1109/..

13

Signal Integrity Analysis of Through-Silicon Via (TSV) With..:

Kim, Hyunwoong ; Lee, Seonghi ; Park, Jongcheol...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 5 - p. 700-714 , 2023

Link: https://doi.org/10.1109/..

14

Neural consequences of binaural beat stimulation on auditor..:

Kim, Jeahong ; Kim, Hyun-Woong ; Kovar, Jessica.
Cerebral Cortex. , 2023

Link: https://doi.org/10.1093/..

15

Noise Source Impedance Extraction Method of Switched-Mode P..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),

Rhee, Jaewon ; Kim, Hyunwoong ; Chu, Kwanguk. - p. 443-447 , 2023

Link: https://doi.org/10.1109/..