E-LIB Suche - Ergebnisse für: Kim, Jae-Ha

1

Measurement of 3D Wrist Angles by Combining Textile Stretch..:

Kim, Jae-Ha ; Koo, Bon-Hak ; Kim, Sang-Un.
Sensors. 24 (2024) 5 - p. 1685 , 2024

Link: https://doi.org/10.3390/..

2

Development and integration of DAQ system for beam current ..:

Song, Young-Gi ; Kim, Jae-Ha ; Cho, Sung-Yun.
Journal of the Korean Physical Society. , 2024

Link: https://doi.org/10.1007/..

3

Effect of Smart-phone Use According to Types of Carrying a ..:

Jeong, Beom-Cheol ; Kim, Jae-Ha ; Yoo, Kyung-Tae
Journal of The Korean Society of Physical Medicine. 18 (2023) 2 - p. 83-92 , 2023

Link: https://doi.org/10.13066..

4

Development of the integrated application for the RF phase ..:

Cho, SungYun ; Dang, Jeong-Jeung ; Song, Young-Gi..
Journal of the Korean Physical Society. 83 (2023) 8 - p. 595-604 , 2023

Link: https://doi.org/10.1007/..

5

Intense pulsed light surface treatment for improving adhesi..:

Kim, Jae-Ha ; Lee, Choong-Jae ; Min, Kyung Deuk...
Composite Structures. 258 (2021) - p. 113364 , 2021

Link: https://doi.org/10.1016/..

6

Hybrid transient liquid phase sintering bonding of Sn-3.0Ag..:

Min, Kyung Deuk ; Lee, Choong-Jae ; Hwang, Byeong-Uk...
Applied Surface Science. 551 (2021) - p. 149396 , 2021

Link: https://doi.org/10.1016/..

7

Electromigration Behavior of Cu Core Solder Joints Under Hi..:

Jeong, Haksan ; Lee, Choong-Jae ; Kim, Jae-Ha..
Electronic Materials Letters. 16 (2020) 6 - p. 513-519 , 2020

Link: https://doi.org/10.1007/..

8

Effect of SDBS on the oxidation reliability of screen-print..:

Lee, Choong-Jae ; Kim, Jae-Ha ; Hwang, Byeong-Uk..
Journal of Materials Science: Materials in Electronics. 31 (2020) 4 - p. 3035-3041 , 2020

Link: https://doi.org/10.1007/..

9

Pressureless transient liquid phase bonding using SAC305 wi..:

Hwang, Byeong-Uk ; Min, Kyung Deuk ; Lee, Choong-Jae..
Materialia. 12 (2020) - p. 100808 , 2020

Link: https://doi.org/10.1016/..

10

Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pul..:

Jung, Kwang-Ho ; Min, Kyung Deuk ; Lee, Choong-Jae...
Advanced Engineering Materials. 22 (2020) 12 - p. , 2020

Link: https://doi.org/10.1002/..

11

Mechanical reliability of Cu cored solder ball in flip chip..:

Jeong, Haksan ; Min, Kyung Deuk ; Lee, Choong-Jae..
Microelectronics Reliability. 112 (2020) - p. 113918 , 2020

Link: https://doi.org/10.1016/..

12

Pressureless transient liquid phase sintering bonding using..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Hwang, Byeong-Uk ; Min, Kyung Deuk ; Jung, Kwang-Ho... - p. 1855-1860 , 2020

Link: https://doi.org/10.1109/..

13

Bending reliability of Ni–MWCNT composite solder with a dif..:

Lee, Choong-Jae ; Hwang, Byeong-Uk ; Min, Kyung Deuk..
Microelectronics Reliability. 113 (2020) - p. 113934 , 2020

Link: https://doi.org/10.1016/..

14

Effect of Sn-Decorated MWCNTs on the Mechanical Reliability..:

Lee, Choong-Jae ; Min, Kyung Deuk ; Park, Hyun Joon..
Electronic Materials Letters. 15 (2019) 6 - p. 693-701 , 2019

Link: https://doi.org/10.1007/..

15

Electromigration behaviors of Sn58%Bi solder containing Ag-..:

Kim, Jungsoo ; Jung, Kwang-Ho ; Kim, Jae-Ha..
Journal of Alloys and Compounds. 775 (2019) - p. 581-588 , 2019

Link: https://doi.org/10.1016/..