E-LIB Suche - Ergebnisse für: Kim, Sarah Eunkyung

1

Optimization of O2 Plasma Treatment on Cu Surface for Hybri..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Park, Sangwoo ; Lee, Sangmin ; Choi, Junyoung. - p. 303-304 , 2024

2

Two-Step Ar/N₂ Plasma Treatment on SiO₂ Surface for Cu/SiO₂..:

Park, Sangwoo ; Lee, Sangmin ; Kim, Sarah Eunkyung
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 4 - p. 723-728 , 2024

Link: https://doi.org/10.1109/..

3

Evaluation of PVD SiCN for Cu/SiCN Hybrid Bonding:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Choi, Junyoung ; Lee, Sangmin ; Park, Sangwoo. - p. 305-306 , 2024

Link: https://doi.org/10.23919..

4

Unraveling diffusion behavior in Cu-to-Cu direct bonding wi..:

Jeong, Min Seong ; Park, Sang Woo ; Kim, Yeon Ju...
Scientific Reports. 14 (2024) 1 - p. , 2024

Link: https://doi.org/10.1038/..

5

First Demonstration of Enhanced Cu-Cu Bonding at Low Temper..:

Park, Sang Woo ; Hong, Seul Ki ; Kim, Sarah Eunkyung.
IEEE Access. 12 (2024) - p. 82396-82401 , 2024

Link: https://doi.org/10.1109/..

6

Effect of Evaporated and Sputtered Au Nanolayers on Cu Surf..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Lee, Sangmin ; Park, Sangwoo ; Choi, Junyoung. - p. 299-300 , 2024

Link: https://doi.org/10.23919..

7

Fly Cutting for Polymer Planarization in Hybrid Cu Bonding:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Jang, Suin ; Lee, Sangmin ; Park, Sangwoo. - p. 307-308 , 2024

Link: https://doi.org/10.23919..

8

Thermal Transport Properties of Hybrid Bonding With Passiva..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Kim, Hakjun ; Hwang, Jae Young ; Park, Sangwoo... - p. 1609-1612 , 2024

Link: https://doi.org/10.1109/..

9

Guidelines for Area Ratio between Metal Lines and Vias to I..:

Hong, Tae Yeong ; Kim, Sarah Eunkyung ; Park, Jong Kyung.
Electronics. 12 (2023) 21 - p. 4403 , 2023

Link: https://doi.org/10.3390/..

10

Nano-capsuled thermal interface materials filler using defe..:

Choi, Sungjun ; Shin, Dongho ; Kim, Sarah EunKyung...
Microelectronic Engineering. 281 (2023) - p. 112082 , 2023

Link: https://doi.org/10.1016/..

11

Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bo..:

Lee, Sangmin ; Park, Sangwoo ; Kim, Sarah Eunkyung
Applied Sciences. 14 (2023) 1 - p. 147 , 2023

Link: https://doi.org/10.3390/..

12

Compact, Flexible and Transparent Antenna Using MMF for Con..:

Nguyen, Tien Dat ; Kim, Sarah Eunkyung ; Jung, Chang Won
Journal of Electrical Engineering & Technology. 18 (2023) 6 - p. 4341-4352 , 2023

Link: https://doi.org/10.1007/..

13

Copper Bonding Technology in Heterogeneous Integration:

Lee, Yoon-Gu ; McInerney, Michael ; Joo, Young-Chang..
Electronic Materials Letters. 20 (2023) 1 - p. 1-25 , 2023

Link: https://doi.org/10.1007/..

14

Investigation of Cu-to-Cu and Oxide-to-Oxide Bonding:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Lee, Sangmin ; Oh, Gwangsik ; Choi, Junyoung... - p. 1519-1523 , 2023

Link: https://doi.org/10.1109/..

15

Thermomechanical Challenges of 2.5-D Packaging: A Review of..:

Kim, Hakjun ; Hwang, Jae Young ; Kim, Sarah Eunkyung..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 10 - p. 1624-1641 , 2023

Link: https://doi.org/10.1109/..