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X
King, Ya Chin
2127  Ergebnisse:
Personensuche X
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1

A Novel Sub-20 V Contact Gate Metal Oxide Semiconductor Fie..:

Lee, Te Liang ; Tsai, Ming Tsang ; King, Ya Chin.
Japanese Journal of Applied Physics.  52 (2013)  4S - p. 04CC16 , 2013
Link: https://doi.org/10.7567/..
 
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2

A novel channel-program–erase technique with substrate tran..:

Hsu, Tzu-Hsuan ; King, Ya Chin ; Wu, Jau-Yi...
Solid-State Electronics.  51 (2007)  11-12 - p. 1523-1528 , 2007
Link: https://doi.org/10.1016/..
 
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3

A Study of Physical Unclonable Function by Dielectric Break..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Geng-Shiu ; King, Ya-Chin ; Lin, Chrong-Jung - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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4

Complementary Detectors for DUV Sensing by CMOS Logic Techn..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Huang, Ting-Kai ; Yeh, Hsin-Hung ; Shih, Jiaw-Ren.. - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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5

High-density via RRAM cell with multi-level setting by curr..:

Hsieh, Yu-Cheng ; Lin, Yu-Cheng ; Huang, Yao-Hung...
Discover Nano.  19 (2024)  1 - p. , 2024
Link: https://doi.org/10.1186/..
 
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6

Advanced self-convergent calibration for selenized two-dime..:

Liu, Che-Chuan ; Shen, Hsin-Yi ; Wang, Kuangye...
Japanese Journal of Applied Physics.  63 (2024)  2 - p. 02SP34 , 2024
Link: https://doi.org/10.35848..
 
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7

CMOS-Compatible Embedded Artificial Synaptic Device (eASD) ..:

Huang, Yao-Hung ; Yu, Hsin-Yuan ; Chih, Yue-Der...
IEEE Transactions on Electron Devices.  71 (2024)  2 - p. 1313-1319 , 2024
Link: https://doi.org/10.1109/..
 
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8

On-Wafer FinFET-Based 3-D E-Beam Detector Cube for In Situ ..:

Teng, Yu-Jie ; Chao, Ho-Ting ; Chang, Wei...
IEEE Transactions on Electron Devices.  71 (2024)  6 - p. 3739-3745 , 2024
Link: https://doi.org/10.1109/..
 
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9

A New High Density 3D Stackable Via RRAM for Computing-in-M..:

Sing, Siao-Ping ; Wang, Ya-Ching ; Lin, Wei-Hwa...
IEEE Transactions on Electron Devices.  71 (2024)  4 - p. 2399-2403 , 2024
Link: https://doi.org/10.1109/..
 
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10

High-Density Embedded 3-D Stackable Via RRAM in 16-nm FinFE..:

Huang, Yao-Hung ; Hsieh, Yu-Cheng ; Lin, Yu-Cheng...
IEEE Transactions on Electron Devices.  71 (2024)  6 - p. 3614-3619 , 2024
Link: https://doi.org/10.1109/..
 
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11

A New Ultra-Low Voltage Metal Fuse for High Density OTP App..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Wang, Li-Yu ; Chen, Kuan-Ju ; Yuh, Perng-Fei... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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12

Application of twin-bit self-rectifying via RRAM with uniqu..:

Lin, Yu-Cheng ; Huang, Yao-Hung ; Chuang, Kai-Ching...
Japanese Journal of Applied Physics.  63 (2024)  2 - p. 02SP55 , 2024
Link: https://doi.org/10.35848..
 
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13

High Density Embedded 3D Stackable Via RRAM in Advanced MCU..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Huang, Yao-Hung ; Hsieh, Yu-Cheng ; Lin, Yu-Cheng... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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14

Offset-Via Anti-fuse by Cu BEOL Process in Advanced CMOS Te..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Yeh, Li-Yu ; Lin, Chrong-Jung ; King, Ya-Chin - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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15

A study of hydrogen plasma-induced charging effect in EUV l..:

Huang, Yao-Hung ; Lin, Chrong Jung ; King, Ya-Chin
Discover Nano.  18 (2023)  1 - p. , 2023
Link: https://doi.org/10.1186/..
 
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