E-LIB Suche - Ergebnisse für: Kita, Koji

1

Investigating the mechanism of SiO2/4H-SiC interface traps ..:

Wang, Runze ; NOGUCHI, Munetaka ; Hino, Shiro.
Applied Physics Express. , 2024

Link: https://doi.org/10.35848..

2

(Invited) Role of Oxidant Gas for Atomic Layer Deposition o..:

Onaya, Takashi ; Kita, Koji
ECS Transactions. 113 (2024) 2 - p. 51-59 , 2024

Link: https://doi.org/10.1149/..

3

Comparative study of mechanical stress-induced flat-band vo..:

Chu, Qiao ; Masunaga, Masahiro ; Shima, Akio.
Japanese Journal of Applied Physics. 63 (2024) 3 - p. 030901 , 2024

Link: https://doi.org/10.35848..

4

Enhancement of remnant polarization in ferroelectric HfO2 t..:

Inoue, Tatsuya ; Onaya, Takashi ; Kita, Koji
Applied Physics Express. 17 (2024) 5 - p. 051003 , 2024

Link: https://doi.org/10.35848..

5

Low-Temperature Annealing in O2 to Annihilate the Fixed Cha..:

Yang, Tianlin ; Onaya, Takashi ; Kita, Koji
IEEE Electron Device Letters. 45 (2024) 7 - p. 1145-1148 , 2024

Link: https://doi.org/10.1109/..

6

Structural distortion in ferroelectric HfO2 – The factor th..:

Nittayakasetwat, Siri ; Momiyama, Haruki ; Kita, Koji
Solid-State Electronics. 204 (2023) - p. 108639 , 2023

Link: https://doi.org/10.1016/..

7

Opportunity to achieve an efficient SiC/SiO2 interface N pa..:

Yang, Tianlin ; Kita, Koji
Solid-State Electronics. 210 (2023) - p. 108815 , 2023

Link: https://doi.org/10.1016/..

8

Effect of Ni additive on electroless Cu quality for high de..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Zhang, Zheng ; Hsieh, Ming-Chun ; Nishijima, Masahiko... - p. 155-156 , 2023

Link: https://doi.org/10.23919..

9

Verification of modulation mechanism of the interfacial dip..:

Tamura, Atsushi ; Kita, Koji
Journal of Applied Physics. 134 (2023) 23 - p. , 2023

Link: https://doi.org/10.1063/..

10

Effects of oxidant gas for atomic layer deposition on cryst..:

Onaya, Takashi ; Nabatame, Toshihide ; Nagata, Takahiro...
Solid-State Electronics. 210 (2023) - p. 108801 , 2023

Link: https://doi.org/10.1016/..

11

Relaxation of the Distorted Lattice of 4H-SiC (0001) Surfac..:

Hatmanto, Adhi Dwi ; Kita, Koji
Solid State Phenomena. 345 (2023) - p. 131-136 , 2023

Link: https://doi.org/10.4028/..

12

Preface: Special issue on control of semiconductor interfac..:

Shiojima, Kenji ; Nakatsuka, Osamu ; Kita, Koji..
Materials Science in Semiconductor Processing. 158 (2023) - p. 107386 , 2023

Link: https://doi.org/10.1016/..

13

Study of Cu Micro-via by TOF-SIMS and STEM:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Nishijima, Masahiko ; Hsieh, Ming-Chun ; Zheng, Zhang... - p. 151-152 , 2023

Link: https://doi.org/10.23919..

14

Fine Pitch Micro Via Interconnection with Reliable Electrol..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Hsieh, Ming-Chun ; Zhang, Zheng ; Nishijima, Masahiko... - p. 1381-1384 , 2023

Link: https://doi.org/10.1109/..

15

Electroless Plating on Coiled Algae to Copper Microcoils an..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Arikiyo, Keita ; Iyoda, Tomokazu ; Kita, Koji... - p. 159-160 , 2023

Link: https://doi.org/10.23919..