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Klengel, Robert
45  Ergebnisse:
Personensuche X
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1

Silver Bonding Wire – An Alternative for Mechanical Sensiti..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Klengel, Robert ; Klengel, Sandy ; Tismer, Sebastian... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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2

Microstructural Based Reliability Investigation of Water- a..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Klengel, Sandy ; Klengel, Robert ; Stephan, Tino - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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3

Comprehensive Study of Long-Term Reliability of Copper Bond..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Klengel, Robert ; Klengel, Sandy ; Tismer, Sebastian... - p. 489-494 , 2022
Link: https://doi.org/10.1109/..
 
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4

How Copper Wire Material Additive Elements Effect the Relia..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Klengel, Robert ; Klengel, Sandy ; Petzold, Matthias... - p. 1-7 , 2020
Link: https://doi.org/10.1109/..
 
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5

Influence of Copper Wire Material Additive Elements to the ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Klengel, Robert ; Klengel, Sandy ; Schischka, Jan... - p. 774-781 , 2020
Link: https://doi.org/10.1109/..
 
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6

Korrelation von Schertestergebnissen und Zuverlässigkeit f.. 

Schlussbericht zu IGF-Vorhaben Nr. 19271 BG : Berichtszeitr... 
Klengel, Robert ; Hempel, Martin , 28.10.2019
Link: https://edocs.tib.eu/fil..
 
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7

Investigation of mechanical and microstructural properties ..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Lorenz, Georg ; Naumann, Falk ; Klengel, Robert... - p. 1-6 , 2019
Link: https://doi.org/10.23919..
 
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8

Influence of copper wire material to corrosion resistant pa..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Klengel, Sandy ; Klengel, Robert ; Schischka, Jan... - p. 1-8 , 2019
Link: https://doi.org/10.23919..
 
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9

Room temperature wedge–wedge ultrasonic bonding using alumi..:

Dohle, Rainer ; Petzold, Matthias ; Klengel, Robert..
Microelectronics Reliability.  51 (2011)  1 - p. 97-106 , 2011
Link: https://doi.org/10.1016/..
 
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10

Focal clusters of peri-synaptic matrix contribute to activi..:

Chelini, Gabriele ; Mirzapourdelavar, Hadi ; Durning, Peter...
Cell Reports.  43 (2024)  5 - p. 114112 , 2024
Link: https://doi.org/10.1016/..
 
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11

Cello Recital: Auner, Thomas Michael - BEETHOVEN, L. van / .. 

Naxos Music Library
Schumann, Robert ; Beethoven, Ludwig van ; Brahms, Johannes.. , 2023
Link: http://suub.naxosmusicli..
 
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12

Produktivkräfte und Gesellschaftsformationen in vorkapital.. 

Veröffentlichungen des Zentralinstituts für Alte Geschichte und Archäologie der Akademie der Wissenschaften der DDR ; 12
Adams, Robert Mcc. ; Beentjes, Burchakd ; Beiaîtt, Pierre... - Reprint 2022 . , [2022]
Link: https://doi.org/10.1515/..
 
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13

KLIEGEL, Maria: Anniversary Edition 

Naxos Music Library
Barchet, Siegfried ; Bruch, Max ; Chopin, Fryderyk... , 2022
Link: https://suub.naxosmusicl..
 
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14

Recent Developments in Hittite Archaeology and History 

Papers in Memory of Hans G. Guterbock 
Alexander, Robert L ; Archi, Alfonso ; Beckman, Gary... , [2021]
Link: https://www.degruyter.co..
 
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15

Suture button versus syndesmotic screw in ankle fractures -..:

Hennings, Robert ; Souleiman, Firas ; Heilemann, Martin...
BMC Musculoskeletal Disorders.  22 (2021)  1 - p. , 2021
Link: https://doi.org/10.1186/..
 
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